Used CVD Equipment
309 resultsSRH820 Description PVD: Sputter Year(s) : 2006 Location : ASIA (North East)
Price : On request
More details• Operation: Manual • Vacuum Chamber Type: Glass bell jar • Vacuum Chamber Inner Diameter: Approx. 300 mm • Va Location : ASIA (North East)
Price : On request
More details- CV Plotter - 200mm Manual Load - Heated Chuck - HP 4284A - HP 4140B - Keithley 236 - CSM/WIN Software Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details• Deposition Sources: two low-voltage thermal evaporation sources • Pump Type: built-in turbo molecular pump • Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details• Wafer Size Minimum: 50 mm • Wafer Size Maximum: 200 mm • Set Size: 100 mm • Number of Chambers: 1 • Process Year(s) : 1999 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details4410 sputtering system 3 DELTA TARGETS CTI CRYOPUMP (REBUILT) WITH COMPRESSOR VACUUM VALVES REBUILT NEW HMI/PL Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details• Configuration: Open-loop (non-loadlocked) chamber • Precursor channels: 2 for metal-organic precursors, 1 fo Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsEndura-Copper Chamber no Chuck, no PSUs, No Evs beside this complete Year(s) : 2011 Location : EUROPE (Western and Northern)
Price : On request
More detailsex-1204 (exhaust controller) cable(cx-1204 mainbody) Year(s) : 1988 Location : ASIA (China - Taiwan - HKG)
Price : On request
More detailsFeatures: - thin film deposition - encapsulation - coating - eg SiO 2 , SiN x , SiON x , a Si - up to 200 mm w Year(s) : 2015 Location : EUROPE (Western and Northern)
Price : On request
More detailsAPPLIED MATERIALS AMAT CENTURA II consisting of: - 2 DPS / DTM Chambers - Configured for 200mm - Vintage: 2019 Year(s) : 2019 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsSoftware Ver: B6.50 CB1 Amps: 300A Vita Controller Flow Point Model: Nano Valve Gas Panel Type: Configurable W Year(s) : 2006 Location : EUROPE (Western and Northern)
Price : On request
More detailsThe system is configured for analysis and dosing of Dow’s Intervia 8540 Electrolytic Cu plating bath. -20L Res Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsWafer Size Range Minimum 150 mm Maximum 200 mm Set Size 200 mm Number of Chambers 3 Process Capabi Year(s) : 2012 Location : EUROPE (Western and Northern)
Price : On request
More detailsWafer Size Range Minimum 150 mm Maximum 200 mm Set Size 150 mm Number of Cassette Platforms 24 Rob Location : EUROPE (Western and Northern)
Price : On request
More details- Load Locked Chamber - System PC, Keyboard, Mouse - Windows 7 w/ PC4000 Software - 490mm Diameter Aluminum L Year(s) : 2012 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsOXFORD PLASMALAB 100 PECVD consisting of: - Model: Plasmalab 100 PECVD - Process: SiO2 and SiN deposition - Ma Year(s) : 2008 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsSystem configured for AsP use Version: 100 mm • E475 Stainless Steel High Efficiency Growth Chamber. Year(s) : 2010 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details- Manual Wafer Load Plasma Asher - Used for Wafer Cleaning and Descum - Can Process up to 150mm Wafers - Farad Year(s) : 2000 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsThin Flim Deposition Controller Other Information System Components: Control unit: P/N 753-003-G1 Sensor cont Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsApplied Materials Raider Edge ECD Liftoff Tool 3ea Process Tanks 2ea Chemical Dispense Cabinets HCl, Dilute HF Year(s) : 2019 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsICP-PECVD deposition system for solar wafers Version: 156 mm square (200 mm) Vintage: 01.06.2015 PECVD deposi Year(s) : 2015 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsLarge Area PECVD system, used for SiO and SiN process depositions Version: 150 mm Vintage: 01.06.2015 Plasmat Year(s) : 2015 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsPrecision 5000 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsElectroplating Deposition Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsYou can find used CVD Equipment on Wotol
The main manufacturers of CVD Equipment are AMAT, TEL, Applied Materials, Plasmatherm, Novellus, Aixtron, Oxford, ASM, Kokusai, Varian, Anelva, CVC Products, Canon, CVC, Aixtron, Anatech, Applied, Centrotherm, DNS, Emitech, ESC, First, Hitachi, Industrial, J.C. Schumacher, Jusung Engineering, Kas, Kokusai, Lam Research, Leybold, Matheisson, Mattson, MRC, Novellus, Novellus Systems, Oxford Instruments, Perkin Elmer, SVG, Technica, TEL, Tempress, Tepla, Thomas Swan, Ulvac, Unaxis, Varian, Veeco, Watkins Johnson
The main model P5000Series, Quixace, UltimaX, OCEAN, PXJ-200, C1 TEOS, A412, Eagle XP8, IDC S6961, C-7100GT, K950, 790Series, SLR 730, 643, 7300, 2400-SSA, 601, PT530, Plasmalab 800Series, Raider ECD210 / R310PD23SRD6CFD06AY03, LT-210C 2-2-1, 5000, ATS-15 TLC ABU/TLC, ILC-1012, SRH820, SV-9040-T14, I-2300SRE, APT4800, P-5000, TC2300, SJF-1000, 80B, Eagle-10, ALPHA-303i, L-430S-FHL, VDS-5600, SPEED C2, Endura 5500, SLR-770, NGP1000, TS-81003, Eureka 2000, Ultima X, PEIIA, 1500, 999R, Z-550, SE APF, AMP-3300, ET 3000, Concept-1 200, SC-W60A-AVFG
HS Code 8486 30 21 for Chemical Vapour Deposition (CVD) equipment
HS Code 8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in Note 9 (C) to this Chapter; parts and accessories.