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Used CVD Equipment

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Brand: JPEL P-CVD Lead Time Immediately Year(s) : 1999 Location : ASIA (North East)

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DxL Wafer Size 8" Location : ASIA (North East)

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Vertical Furnace for LPCVD SOD Process Version: 200 mm Vintage: 01.06.2007 Vintage 2007.01 Software OS L Year(s) : 2007 Location : AMERICA North (USA-Canada-Mexico)

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Sputtering System 2400 – 8L Load Lock Sputter Deposition Coater Comes with AE MDX 1K RF Power Generator Location : AMERICA North (USA-Canada-Mexico)

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8 inch substrate. Manual load/unload. Vacuum function. Location : AMERICA North (USA-Canada-Mexico)

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PVD cluster tool Version: 150 mm Vintage: 01.06.1990 This tool was not operational prior to removal and has m Year(s) : 1990 Location : AMERICA North (USA-Canada-Mexico)

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ICP PECVD system for solar cells production Version: Solar Vintage: 01.06.2015 -STILL INSTALLED. IN EXCELLENT Year(s) : 2015 Location : AMERICA North (USA-Canada-Mexico)

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Ion Implanter/8in Year(s) : 2004 Location : ASIA (North East)

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2 CVD Chamber 6 inch complete ENI OEM-12B AMAT-0 chiller Location : EUROPE (Western and Northern)

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Diffusion LPCVD Nitride x01 Reactor Wafer Size 8 Location : EUROPE (Western and Northern)

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PECVD (Chemical Vapor Deposition) WAFER SIZE 12 Location : EUROPE (Western and Northern)

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Materials Research Corp. 8671 RF Sputtering Vacuum Chamber Location : AMERICA North (USA-Canada-Mexico)

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Wafer Size Range Maximum 150 mm Set Size 125 mm Controller Type Microprocessor Controller Type Contr Year(s) : 1997 Location : AMERICA North (USA-Canada-Mexico)

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Features 2 - 4 channel valve control PCB (for the nupro valves) • 1/8" tubing for the nupro valves (~40 ft) • Location : AMERICA North (USA-Canada-Mexico)

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ENDURA IMP Ti/TiN PVD 200 mm SNNF Wide body L/L HP Robots 2 x OD 2 x PCII 2 x IMP TiN 1 x IMP Ti 2 x CTI 96 Year(s) : 2000 Location : EUROPE (Western and Northern)

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Tool Status: Deinstalled and crated and in storage. (March 2023) Wafer Size 300 mm Process PE-ALD System Softw Year(s) : 2010 Location : EUROPE (Western and Northern)

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Typ: 10000186 UV 300/400 50 Hz 3” Chuck, 4” x 4” Mask Holder Objectiv Leitz 5x 0,09; 10x 0,20; 20x 0,40; 32 Year(s) : 2004 Location : EUROPE (Western and Northern)

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This furnace can handle wafers up to 150mm Configuration: N2 - 1500 l/min N2 - 660 l/min Forming Gas 660l/ Year(s) : 1999 Location : EUROPE (Western and Northern)

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This furnace can handle wafers up to 150mm Configuration: N2 - 1500 l/min N2 - 660 l/min Forming Gas 660l Year(s) : 2000 Location : EUROPE (Western and Northern)

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This furnace can handle wafers up to 150mm Configuration: N2 - 1500 l/min N2 - 660 l/min Forming Gas 660l Year(s) : 1994 Location : EUROPE (Western and Northern)

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Description CVD Deposition with ECR source Wafer Size Range Minimum 50 mm Maximum 300 mm Controller T Year(s) : 2000 Location : AMERICA North (USA-Canada-Mexico)

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Description PECVD TEOS with Load Lock Wafer Size Range Maximum 200 mm Process PECVD & TEOS Controller T Year(s) : 2001 Location : AMERICA North (USA-Canada-Mexico)

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Vacuum System None Vacuum System Chamber made up of the 8" CF 4-way cross, M/N: 600-4T, 304SS 8" CF Door/V Location : AMERICA North (USA-Canada-Mexico)

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Description In-Line Sputtering System Vacuum System Diffusion Pumped Load Lock Included Yes Power Requireme Location : AMERICA North (USA-Canada-Mexico)

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Description Gen 5 PEVCD Chamber - New Accessories Substrate Size: 1200 mm x 1300 mm Location : AMERICA North (USA-Canada-Mexico)

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You can find used  CVD Equipment on Wotol

The main manufacturers of CVD Equipment are AMAT, TEL, Applied Materials, Plasmatherm, Novellus, Aixtron, Oxford, ASM, Kokusai, Varian, Anelva, CVC Products, Canon, CVC, Aixtron, Anatech, Applied, Centrotherm, DNS, Emitech, ESC, First, Hitachi, Industrial, J.C. Schumacher, Jusung Engineering, Kas, Kokusai, Lam Research, Leybold, Matheisson, Mattson, MRC, Novellus, Novellus Systems, Oxford Instruments, Perkin Elmer, SVG, Technica, TEL, Tempress, Tepla, Thomas Swan, Ulvac, Unaxis, Varian, Veeco, Watkins Johnson

The main model P5000Series, Quixace, UltimaX, OCEAN, PXJ-200, C1 TEOS, A412, Eagle XP8, IDC S6961, C-7100GT, K950, 790Series, SLR 730, 643, 7300, 2400-SSA, 601, PT530, Plasmalab 800Series, Raider ECD210 / R310PD23SRD6CFD06AY03, LT-210C 2-2-1, 5000, ATS-15 TLC ABU/TLC, ILC-1012, SRH820, SV-9040-T14, I-2300SRE, APT4800, P-5000, TC2300, SJF-1000, 80B, Eagle-10, ALPHA-303i, L-430S-FHL, VDS-5600, SPEED C2, Endura 5500, SLR-770, NGP1000, TS-81003, Eureka 2000, Ultima X, PEIIA, 1500, 999R, Z-550, SE APF, AMP-3300, ET 3000, Concept-1 200, SC-W60A-AVFG

HS Code 8486 30 21 for Chemical Vapour Deposition (CVD) equipment
HS Code 8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in Note 9 (C) to this Chapter; parts and accessories. 

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