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Used Wafer Equipment

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1

Specifications Applicable Frame Size: 8"/6" Applicable Wafer Size: 8"/6" Applicable Wafer Thickness: 200µm or Location : ASIA (North East)

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Precision P5000 Platform Wafer Size Range Minimum 150 mm Maximum 200 mm Set Size 200 mm Cassette to Year(s) : 2001 Location : EUROPE (Western and Northern)

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VOLLAUTOM. FOLIERANLAGE, NITTO - DR - 8500 / PFM3 Wafer Size Range Minimum 150 mm Maximum 200 mm Set Year(s) : 2000 Location : EUROPE (Western and Northern)

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Wafer Size Range Minimum 150 mm Maximum 200 mm Set Size 200 mm Accessories Spare parts list: see Year(s) : 2015 Location : EUROPE (Western and Northern)

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Wafer Size Range Minimum 150 mm Maximum 200 mm Set Size 200 mm Condition Very Good Year of Manufac Year(s) : 2000 Location : EUROPE (Western and Northern)

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Wafer Size Range Minimum 150 mm Maximum 200 mm Set Size 200 mm Cassette to Cassette YES Accessori Year(s) : 1998 Location : EUROPE (Western and Northern)

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1

Precision P5000 Platform Wafer Size Range Minimum 150 mm Maximum 200 mm Set Size 150 mm Cassette to Location : EUROPE (Western and Northern)

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1

Wafer Size Range Minimum 150 mm Maximum 200 mm Set Size 200 mm Accessories Spare parts list: see Year(s) : 2001 Location : EUROPE (Western and Northern)

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Manufacturer Microcontrol Model PFP 6 Description PFP 6 Detaper 408 Wafer Size Range Minimum 150 mm Year(s) : 2003 Location : EUROPE (Western and Northern)

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Accessories Spare parts list: see Excel file Robot handler - original (carbon) Motor for SC1 spincup Extend Year(s) : 2009 Location : EUROPE (Western and Northern)

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31

Mask and Wafer Inspection Loadport : 300mm x 2 Sets DualFIMS Working Condition. Wafer : 300 mm Complete. Year(s) : 2007 Location : ASIA (North East)

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Condition Poor Exterior Dimensions Width 33.465 in (85.0 cm) Depth 52.992 in (134.6 cm) Height 39.7 Year(s) : 1999 Location : EUROPE (Western and Northern)

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FLUOROCARBON RD4500 CLASSIC Description: SRD Version: 100 mm Year(s) : 1986 Location : AMERICA North (USA-Canada-Mexico)

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1

Atmospheric wafer robot( Ebara Frex 300 CMP) Version: 30 0mm Location : AMERICA North (USA-Canada-Mexico)

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1

OEM Group 470S SRD High Performance Spin Rinse Dryer Wafer Cleaner. The SRD is a 25 wafer, batch size, single Location : AMERICA North (USA-Canada-Mexico)

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Semitool STI 870 Spin Rinser Dryer Double Stack. 6” Wafer Rotor in the top spinner and a 4" Rotor in the bott Location : AMERICA North (USA-Canada-Mexico)

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3

Grinder Heavy smoker DTU 150 Chiller DVC 010 Vacuum coolant unit Air supply source: Pressure: 0.5-0.8 MPa Location : ASIA (South East)

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1

• Wafer Size Capability: 5 – 8 inch • Version: 150 mm • Beam Energy: Up to 200 keV • Dose Range: 1×10¹⁰ – 1×10 Year(s) : 2006 Location : AMERICA North (USA-Canada-Mexico)

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• Wafer Size: 200 mm • Chuck Type: Temperature controlled (no chiller or controller included) • Microscope: Mi Location : AMERICA North (USA-Canada-Mexico)

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• Type: Rapid Thermal Processing System • Wafer Sizes: Small pieces, 2", 3", 4", 5", 6", 8" (currently configu Year(s) : 2021 Location : AMERICA North (USA-Canada-Mexico)

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• Type: Manual probe station • Optics: B&L stereo zoom 4 • Optional upgrade: Zoom 5 (+$100), Zoom 7 (+$400) • Location : AMERICA North (USA-Canada-Mexico)

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• Wafer size: 4″ • Optics: Mitutoyo high-power microscope with Microzoom optics • Objectives: 2 included • Chu Location : AMERICA North (USA-Canada-Mexico)

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Used <b> Manufacture : AG Association Model : Heatpulse AG210M </b> Details: Wafer Size : 4" Annealing Chamber Location : AMERICA North (USA-Canada-Mexico)

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<b>Manufacture : Tegal Model : 903e <b>Specification:</b> used Application : Oxide Wafer Size : 6" Operatio Location : AMERICA North (USA-Canada-Mexico)

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- Routinely measures step heights and surface profiles below 200A - A single button automatically initiates sc Location : AMERICA North (USA-Canada-Mexico)

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You can find used Wafer Equipment on Wotol

The main manufacturers of Wafer Equipment are KLA-Tencor, Karl Suss, Canon, Electroglas, Suss, Nikon, Semitool, TEL, Tokyo Semitsu Kogaku (TSK), Branson / IPC, MGI, Ultron, EVG, Allwin21, Abm, Accretech, ADE, AG Associates, AIO, Alessi, Applied Materials, ASM, ASML, Asyst Technologies, ATMI, Axcelis, Brooks Automation, Buehler, Cambridge, Cascade, Cascade Microtech, CDE (Creative Design Engineering), CEE, CHA, Control Micro Systems (CMS), Cymer, Dainippon Screen,Dektak, Denton, Disco, DNK, DNS, Dynapert, Dynatex, Electroglass, EV Group, Evergreen, Faith, Fluoroware, Fortrend Engineering, Gasonics, GCA, GSI Lumonics, Hitachi, HTG, IMT, InspecTech, Ionic Systems, Jeol, K & S, Kensington, KLA, Kokusai, LAM, Lam Research, Leica, Lintec, Loomis, Lumonics, Mactronix, Matsushita, Mech-El, Micro Automation, MRC, MTI, Nanometrics, Nitto, OAI, Olympus, Oriel, Oxford, Perkin Elmer, PRI, Prometrix, Recif SA, Rucker & Kolls, Suss MicroTec, SVG, Takatori, Tegal, Tencor, Tropel, Ultracision, Ultratech, Ulvac, Veeco, Verteq, Wentworth, Xynetics

The main model  MPASeries, CDS-650CT, PLA-501F, MA-4100, NSR-1505G4, 1000, Titan II, MA150,  6033, 2029,2020,2025, 6200Series, SM200E, Step 200,UM810, UH-130, UF3000 EX, SFX100, M777, FPA-5500iZa, SR8220-019, Desktop 1, 270 SRD, ST-260, 1600-55, 8100XP, 8100Series, 1H-DX, KP-4200, MA-4201Series, MA-1006, L200,UH130M,DFM-M150, CEE 100, SP323, MJB3Series, JWSSeries, MA6Series, SWC4000, EX-5700, 2001X, MDA-60FA, 680A, 8300, ARM200CF, S-5200, S-4700, AS5000, Axiotron II, INS330, Axiospect 301, SF 600, WaferMark II,3308, MASeries, 20T2/150VPO, 860, 1600-55A, UH 102, 4000, Eureka 450, ETI0392A-6-U, 425130, ETII-6910B-X-V, EET1-0395D-X-U, ETII-6910B-X-V, F-6225, 827, 907, 211,UVSeries, AIT8010, eCD2, 8100XPR, CD-SEMSeries, 8250, PC 4400, 300405, SFS 6420, 6D, MM-Cascade 6100, MJB-55, 179884/ P-2 OPEN FRAME, 8300X, 4500, ATRM-2100, SWC11, MAS-8000,ATM-1100E, 3A, 90, RTP-600xp, UKA-650, SPP8, MP 2300, BH-BHM, 2066,AL100-L8, IDLW8R, REL-4500, IDLW8R, MAS-8000, Fix Load25, UKA-825, SCW111, ATRM-2100D, 4055/2, Optistation 3, REL-4500, ResMap 178, 8097, 1600-55m, LSD 100, DSL 10, H100, RHM-06, 908, UH-130, 600W, 100FX, RS 35, P16+, 8620, MA8/BA8 Gen3, lle-855SS, 85DD, SFS7700, 2300 Versys, ZX-1000, Mark7, S-7800HSA, 5610,ES3, M-GAUGE 200, AITI,SFS7200, THERMA-WAVE OP 2600, MA150, 2115, 9400, NGP80, 620, XRF3640, CTR-200, TREX 610, F-4225, EET10395-4-U, SYO-200SS, MS100, RS-75, 7400/18, 2001X 6, PLA-501FA, PS300 Parametric Serie 12, DX-III, SHS 1000VAC, V300-Si, 12", WM650, AlphaStep 300, SURFSCAN 7700, 903eSeries, F6000QS, SP1 TB1, Nanolab 600, NWL860-TMB-SP, F5, DSS200, RS35C, MX-50, DD-823V-8BL, MicroSense 6300, 2400, 4400,E5200, 8108, 600FA, 40, MRC 603, 7700, VersaPort 2200, R-3, SSEC M10, ST-270 SRD, L3510, HTC 8020, Lumonics III, 1800-6AR, HTC 4000, SSW-60A-AR, 1034X, WST 306, ST-860, KIS 2000, L3510E, 9350, PSM 6, 80B, RS-35, DR-8500 II, 301, VLR RIE LM/TM, 20T2/150VPO, 1034 XA – 6, 4085XSeries, 682A, 500R 120-1007, E8025S, 100 RIE, M6000L, EV CS50, 150, RC8, ATM-105-1-S-CE-S293, MPC3000, DMI4000B, 5100, F5x, P-10, LP-200H, F200, CMS1030, CW1002-6200RW, 8860, APM90A, 3001X, APM5000, 880

HS Code 8486 10 10 for Apparatus for rapid heating of semiconductor wafers. 
HS Code 8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devicesde8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices

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