Used Wafer Equipment
600 resultsF-REX300, 300 mm, Cu CMP Polish Tool ID: ED05 Year(s) : 2002 Location : EUROPE (Western and Northern)
Price : On request
More detailsSingle Wafer Process Single Rotometer Controlled Gas Channel Multi-Step Process Cycle Capability P Year(s) : 1987 Location : EUROPE (Western and Northern)
Price : On request
More detailsES 3CH / INT340, Tool ID: PSX4603 Year(s) : 2011 Location : EUROPE (Western and Northern)
Price : On request
More detailsInnolas Wafermarker Wafermarker C3000DPS Marking for 300mm Wafers Wafer Size Range Minimum 200 mm Maximum 3 Year(s) : 2002 Location : EUROPE (Western and Northern)
Price : On request
More detailsManufacturer: Bondztek Model: Bondztek Wafer Mount Wafer Ring Mounter to foton ring Location : EUROPE (Western and Northern)
Price : On request
More detailsThe Model UH101 Semiautomatic UV Curing System has all of the features of its larger fully automated sibling, Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsSubstrate Size Up to 100mm Wafer Size Range Maximum 100 mm Controller Type Microprocessor Controller Type Con Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsCoater/Developer Location : ASIA (North East)
Price : On request
More detailsprobe: Wafer Probing Tester Location : ASIA (North East)
Price : On request
More detailsinsp: E-Beam Wafer inspection Year(s) : 2014, 2015 Location : ASIA (North East)
Price : On request
More detailsinsp: E-Beam Wafer inspection Year(s) : 2012 Location : ASIA (North East)
Price : On request
More detailsProber/300mm Year(s) : 2004 Location : ASIA (North East)
Price : On request
More detailsProber Year(s) : 1994 Location : ASIA (North East)
Price : On request
More detailsProber Location : ASIA (North East)
Price : On request
More detailsProber Year(s) : 1995 Location : ASIA (North East)
Price : On request
More detailsProber Year(s) : 2001 Location : ASIA (North East)
Price : On request
More detailsProber Location : ASIA (North East)
Price : On request
More detailsLaser Repair Location : ASIA (North East)
Price : On request
More detailsion: Implanter/6in Location : ASIA (North East)
Price : On request
More detailsion: Implanter/6in. Location : ASIA (North East)
Price : On request
More detailsStepper/6in Location : ASIA (North East)
Price : On request
More detailscle: Automatic transfer Location : ASIA (North East)
Price : On request
More detailstrans: Wafer Management System Location : ASIA (North East)
Price : On request
More detailsCleaner/Wafer Year(s) : 2005 Location : ASIA (North East)
Price : On request
More detailsStepper Location : ASIA (North East)
Price : On request
More detailsYou can find used Wafer Equipment on Wotol
The main manufacturers of Wafer Equipment are KLA-Tencor, Karl Suss, Canon, Electroglas, Suss, Nikon, Semitool, TEL, Tokyo Semitsu Kogaku (TSK), Branson / IPC, MGI, Ultron, EVG, Allwin21, Abm, Accretech, ADE, AG Associates, AIO, Alessi, Applied Materials, ASM, ASML, Asyst Technologies, ATMI, Axcelis, Brooks Automation, Buehler, Cambridge, Cascade, Cascade Microtech, CDE (Creative Design Engineering), CEE, CHA, Control Micro Systems (CMS), Cymer, Dainippon Screen,Dektak, Denton, Disco, DNK, DNS, Dynapert, Dynatex, Electroglass, EV Group, Evergreen, Faith, Fluoroware, Fortrend Engineering, Gasonics, GCA, GSI Lumonics, Hitachi, HTG, IMT, InspecTech, Ionic Systems, Jeol, K & S, Kensington, KLA, Kokusai, LAM, Lam Research, Leica, Lintec, Loomis, Lumonics, Mactronix, Matsushita, Mech-El, Micro Automation, MRC, MTI, Nanometrics, Nitto, OAI, Olympus, Oriel, Oxford, Perkin Elmer, PRI, Prometrix, Recif SA, Rucker & Kolls, Suss MicroTec, SVG, Takatori, Tegal, Tencor, Tropel, Ultracision, Ultratech, Ulvac, Veeco, Verteq, Wentworth, Xynetics
The main model MPASeries, CDS-650CT, PLA-501F, MA-4100, NSR-1505G4, 1000, Titan II, MA150, 6033, 2029,2020,2025, 6200Series, SM200E, Step 200,UM810, UH-130, UF3000 EX, SFX100, M777, FPA-5500iZa, SR8220-019, Desktop 1, 270 SRD, ST-260, 1600-55, 8100XP, 8100Series, 1H-DX, KP-4200, MA-4201Series, MA-1006, L200,UH130M,DFM-M150, CEE 100, SP323, MJB3Series, JWSSeries, MA6Series, SWC4000, EX-5700, 2001X, MDA-60FA, 680A, 8300, ARM200CF, S-5200, S-4700, AS5000, Axiotron II, INS330, Axiospect 301, SF 600, WaferMark II,3308, MASeries, 20T2/150VPO, 860, 1600-55A, UH 102, 4000, Eureka 450, ETI0392A-6-U, 425130, ETII-6910B-X-V, EET1-0395D-X-U, ETII-6910B-X-V, F-6225, 827, 907, 211,UVSeries, AIT8010, eCD2, 8100XPR, CD-SEMSeries, 8250, PC 4400, 300405, SFS 6420, 6D, MM-Cascade 6100, MJB-55, 179884/ P-2 OPEN FRAME, 8300X, 4500, ATRM-2100, SWC11, MAS-8000,ATM-1100E, 3A, 90, RTP-600xp, UKA-650, SPP8, MP 2300, BH-BHM, 2066,AL100-L8, IDLW8R, REL-4500, IDLW8R, MAS-8000, Fix Load25, UKA-825, SCW111, ATRM-2100D, 4055/2, Optistation 3, REL-4500, ResMap 178, 8097, 1600-55m, LSD 100, DSL 10, H100, RHM-06, 908, UH-130, 600W, 100FX, RS 35, P16+, 8620, MA8/BA8 Gen3, lle-855SS, 85DD, SFS7700, 2300 Versys, ZX-1000, Mark7, S-7800HSA, 5610,ES3, M-GAUGE 200, AITI,SFS7200, THERMA-WAVE OP 2600, MA150, 2115, 9400, NGP80, 620, XRF3640, CTR-200, TREX 610, F-4225, EET10395-4-U, SYO-200SS, MS100, RS-75, 7400/18, 2001X 6, PLA-501FA, PS300 Parametric Serie 12, DX-III, SHS 1000VAC, V300-Si, 12", WM650, AlphaStep 300, SURFSCAN 7700, 903eSeries, F6000QS, SP1 TB1, Nanolab 600, NWL860-TMB-SP, F5, DSS200, RS35C, MX-50, DD-823V-8BL, MicroSense 6300, 2400, 4400,E5200, 8108, 600FA, 40, MRC 603, 7700, VersaPort 2200, R-3, SSEC M10, ST-270 SRD, L3510, HTC 8020, Lumonics III, 1800-6AR, HTC 4000, SSW-60A-AR, 1034X, WST 306, ST-860, KIS 2000, L3510E, 9350, PSM 6, 80B, RS-35, DR-8500 II, 301, VLR RIE LM/TM, 20T2/150VPO, 1034 XA – 6, 4085XSeries, 682A, 500R 120-1007, E8025S, 100 RIE, M6000L, EV CS50, 150, RC8, ATM-105-1-S-CE-S293, MPC3000, DMI4000B, 5100, F5x, P-10, LP-200H, F200, CMS1030, CW1002-6200RW, 8860, APM90A, 3001X, APM5000, 880
HS Code 8486 10 10 for Apparatus for rapid heating of semiconductor wafers.
HS Code 8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devicesde8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices