Used Wafer Equipment
600 resultsChip mounter Maker Panasonic Model CM 202-D Year(s) : 1999 Location : ASIA (North East)
Price : On request
More detailsChip mounter Maker Panasonic Model CM 20F-M Year(s) : 1998 Location : ASIA (North East)
Price : On request
More detailsChip mounter Maker Panasonic Model CM 402M Year(s) : 2004 Location : ASIA (North East)
Price : On request
More detailsChip Mounter Year(s) : 2004 Location : ASIA (North East)
Price : On request
More detailsChip Mounter Year(s) : 2004 Location : ASIA (North East)
Price : On request
More detailsMicroscope: Stereo Carton Year(s) : 2006 Location : ASIA (North East)
Price : On request
More detailsAligner/Mask Location : ASIA (North East)
Price : On request
More detailsAligner: Semi-Automated Bottom Sude Mask Aligner Year(s) : 2017 Location : ASIA (North East)
Price : On request
More detailsmicroscope/Metallurgical Year(s) : 1985 Location : ASIA (North East)
Price : On request
More detailsInspection: wafer Year(s) : 2008 Location : ASIA (North East)
Price : On request
More detailsMicroscope: Quick Vision System Location : ASIA (North East)
Price : On request
More detailsAligner/5in. Location : ASIA (North East)
Price : On request
More detailsAligner Location : ASIA (North East)
Price : On request
More detailsAligner: Mask Year(s) : 2002 Location : ASIA (North East)
Price : On request
More detailsOther: Autocollimator Location : ASIA (North East)
Price : On request
More detailsWafer Size Range Minimum 200 mm Maximum 300 mm Set Size 300 mm Wafer Handler Size Range Minimum Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details• Type: Automatic motor-driven wafer film laminator • Lamination Method: One-pass uniform film lamination • La Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details• Wafer Size: up to 200 mm (8”) • Probe Station Type: Manual, high-precision • Measurement Environment: – Inte Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsFire retardant polypropalene construction High purity PVDF plumbing and teflon valves PFA teflon spray guns fo Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsThe spin rinse dryer is used for rinsing and drying substrates. A safety emergency stop for the nitrogen heate Year(s) : 2015 Location : EUROPE (Western and Northern)
Price : On request
More detailsThe Spin Rinse Dryer is used for rinsing and drying substrates. Max. size: 8" low profile, NOT Aus on the fro Year(s) : 2017 Location : EUROPE (Western and Northern)
Price : On request
More detailsSussMicrotec Mask Aligner MA 150e Remanufactured Automatic Mask Aligner System, Configuration: Suss MA 100/15 Year(s) : 2010 Location : EUROPE (Western and Northern)
Price : On request
More detailsDescription: Exhaust management gas scrubber BOC EDWARDS BOC EDWARDS Longdescription: Equipment Details: Ex Year(s) : 2004 Location : EUROPE (Western and Northern)
Price : On request
More detailsKLA-TENCOR FLX-2320 FILM STRESS MEASUREMENT SYSTEM consisting of: - Model: FLX-2320 - Manual Wafer Load Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsWafer sorter for 300mm wafer Version: 300mm De-installed, warehoused. Can be inspected by appointment. 2 port Location : ASIA (South East)
Price : On request
More detailsYou can find used Wafer Equipment on Wotol
The main manufacturers of Wafer Equipment are KLA-Tencor, Karl Suss, Canon, Electroglas, Suss, Nikon, Semitool, TEL, Tokyo Semitsu Kogaku (TSK), Branson / IPC, MGI, Ultron, EVG, Allwin21, Abm, Accretech, ADE, AG Associates, AIO, Alessi, Applied Materials, ASM, ASML, Asyst Technologies, ATMI, Axcelis, Brooks Automation, Buehler, Cambridge, Cascade, Cascade Microtech, CDE (Creative Design Engineering), CEE, CHA, Control Micro Systems (CMS), Cymer, Dainippon Screen,Dektak, Denton, Disco, DNK, DNS, Dynapert, Dynatex, Electroglass, EV Group, Evergreen, Faith, Fluoroware, Fortrend Engineering, Gasonics, GCA, GSI Lumonics, Hitachi, HTG, IMT, InspecTech, Ionic Systems, Jeol, K & S, Kensington, KLA, Kokusai, LAM, Lam Research, Leica, Lintec, Loomis, Lumonics, Mactronix, Matsushita, Mech-El, Micro Automation, MRC, MTI, Nanometrics, Nitto, OAI, Olympus, Oriel, Oxford, Perkin Elmer, PRI, Prometrix, Recif SA, Rucker & Kolls, Suss MicroTec, SVG, Takatori, Tegal, Tencor, Tropel, Ultracision, Ultratech, Ulvac, Veeco, Verteq, Wentworth, Xynetics
The main model MPASeries, CDS-650CT, PLA-501F, MA-4100, NSR-1505G4, 1000, Titan II, MA150, 6033, 2029,2020,2025, 6200Series, SM200E, Step 200,UM810, UH-130, UF3000 EX, SFX100, M777, FPA-5500iZa, SR8220-019, Desktop 1, 270 SRD, ST-260, 1600-55, 8100XP, 8100Series, 1H-DX, KP-4200, MA-4201Series, MA-1006, L200,UH130M,DFM-M150, CEE 100, SP323, MJB3Series, JWSSeries, MA6Series, SWC4000, EX-5700, 2001X, MDA-60FA, 680A, 8300, ARM200CF, S-5200, S-4700, AS5000, Axiotron II, INS330, Axiospect 301, SF 600, WaferMark II,3308, MASeries, 20T2/150VPO, 860, 1600-55A, UH 102, 4000, Eureka 450, ETI0392A-6-U, 425130, ETII-6910B-X-V, EET1-0395D-X-U, ETII-6910B-X-V, F-6225, 827, 907, 211,UVSeries, AIT8010, eCD2, 8100XPR, CD-SEMSeries, 8250, PC 4400, 300405, SFS 6420, 6D, MM-Cascade 6100, MJB-55, 179884/ P-2 OPEN FRAME, 8300X, 4500, ATRM-2100, SWC11, MAS-8000,ATM-1100E, 3A, 90, RTP-600xp, UKA-650, SPP8, MP 2300, BH-BHM, 2066,AL100-L8, IDLW8R, REL-4500, IDLW8R, MAS-8000, Fix Load25, UKA-825, SCW111, ATRM-2100D, 4055/2, Optistation 3, REL-4500, ResMap 178, 8097, 1600-55m, LSD 100, DSL 10, H100, RHM-06, 908, UH-130, 600W, 100FX, RS 35, P16+, 8620, MA8/BA8 Gen3, lle-855SS, 85DD, SFS7700, 2300 Versys, ZX-1000, Mark7, S-7800HSA, 5610,ES3, M-GAUGE 200, AITI,SFS7200, THERMA-WAVE OP 2600, MA150, 2115, 9400, NGP80, 620, XRF3640, CTR-200, TREX 610, F-4225, EET10395-4-U, SYO-200SS, MS100, RS-75, 7400/18, 2001X 6, PLA-501FA, PS300 Parametric Serie 12, DX-III, SHS 1000VAC, V300-Si, 12", WM650, AlphaStep 300, SURFSCAN 7700, 903eSeries, F6000QS, SP1 TB1, Nanolab 600, NWL860-TMB-SP, F5, DSS200, RS35C, MX-50, DD-823V-8BL, MicroSense 6300, 2400, 4400,E5200, 8108, 600FA, 40, MRC 603, 7700, VersaPort 2200, R-3, SSEC M10, ST-270 SRD, L3510, HTC 8020, Lumonics III, 1800-6AR, HTC 4000, SSW-60A-AR, 1034X, WST 306, ST-860, KIS 2000, L3510E, 9350, PSM 6, 80B, RS-35, DR-8500 II, 301, VLR RIE LM/TM, 20T2/150VPO, 1034 XA – 6, 4085XSeries, 682A, 500R 120-1007, E8025S, 100 RIE, M6000L, EV CS50, 150, RC8, ATM-105-1-S-CE-S293, MPC3000, DMI4000B, 5100, F5x, P-10, LP-200H, F200, CMS1030, CW1002-6200RW, 8860, APM90A, 3001X, APM5000, 880
HS Code 8486 10 10 for Apparatus for rapid heating of semiconductor wafers.
HS Code 8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devicesde8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices