KLA-Tencor HRP 320

Description:
HRP (High Resolution Profiler) series from KLA-Tencor provides a comprehensive automated surface metrology solution for in-line process control of CMP and etch.

Features:
The HRP uses dual-stage, stylus-based scanning to achieve AFM-scale resolution in a production environment
Capable of 12"
Ability to measure even submicron features with a vertical resolution of 0.1Å and a lateral resolution of 1nm
Microscopic and Macroscopic feature resolution.


Specifications:
- Microprocessor: Pentium 200 MHz or faster
- Operating System: Windows NT
- RAM: 128 MB
- Hard Drive: 2GB or greater
- Floppy Drive: 3.5in, 1.4 MB
- Removable Drive: Iomega 1GB Jaz cartridge or equivalent
- Monitor: 17 in SVGA
- Keyboard: Enhanced 101 AT with trackball

- Height: 70.5 in.
- Width: 53 in.
- Depth: 42 in.

- Wafer sizes: 100mm, 125mm, 150mm, 200mm, 300mm
- Maximum Sample Thickness: 63.5mm (2.12 in.)
- Stylus Access: 210mm diameter circular area without repositioning
- X,Y Maximum Travel : 210mm diameter
- X, Y Position Speed: Variable, up to 25mm/sec
- Sample stage XY repeatability: 2µm (0.04mil)
- Maximum Sample Weight: 2.2kg (5lb)
- Rotary Stage: Programmed Rotary Repeatability: 4µ (0.16 mil) at - mm from center
- Angle: 0-360°
- Resolution: 0.1°
- Leveling: Electronic data leveling or semi-automatic mechanical leveling

- Wafer Handler
- Configuration
- Robotic wafer handler and alignment module. Emergency power off button
- Alignment Module

- Settings: Flat, notch or none
- Accuracy: Eccentricity 100-200µm (user selectable)
- Angular ± 0.75°
- Throughput

- 72 wafers/hour (excluding measurement time
- 10 wafers/hour with five 2D line scans (10 sec scan) per wafer, with wafer alignment and pattern recognition