Used Wafer Equipment
440 resultsBrand: DNS Model: 80B Year: 1996 DEVELOP TRACK Specifications • Used • Description Develop track • Manufactur Year(s) : 1996 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsBrand: KLA-Tencor Model: RS-35 RESISTIVITY MAP Specifications - Used - Description Resistivity Map - Configu Location : AMERICA North (USA-Canada-Mexico)
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More detailsC90637 Cascade Microtech PS300 Parametric Serie 12" Automatic Wafer Prober Location : AMERICA North (USA-Canada-Mexico)
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More detailsBrand: ATMI Model: Ecosys Phoenix Hydrogen Active Flame Thermal Oxidizer Used Details: overall unpacked dim Location : AMERICA North (USA-Canada-Mexico)
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More detailsBrand: Dynatex Model: DX-III WAFER SCRIBER BREAKER Specifications - Used - This Wafer Scriber Breaker looks t Location : AMERICA North (USA-Canada-Mexico)
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More detailsBrand: Mattson Model: SHS 1000VAC RAPID THERMAL PROCESSOR Specifications - Used - Rapid Thermal Processor (pr Location : AMERICA North (USA-Canada-Mexico)
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More detailsFeatures: RF etch DC and RF deposition stations PE 2KW RF power supply AE MDX DC P/S Digit Location : AMERICA North (USA-Canada-Mexico)
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More detailsFeatures: 3 source system 2/Deposition and 1/RF DC bias Main processing system with load lock Capa Location : AMERICA North (USA-Canada-Mexico)
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More detailsFeatures: 10x objectives 1000-watt lamphouse UV 400 diffraction reducing optics 365nm/405nm in Location : AMERICA North (USA-Canada-Mexico)
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More detailsSpecifications: For wafers from 2" to 6" or substrates from 3" x 3" up to 6"6" Fiber optics tube: 2 ar Location : AMERICA North (USA-Canada-Mexico)
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More detailsSpecifications: UV broadband (250nm-450nm), I-line (365nm) and G-line (436nm) wavelength available. Contac Location : AMERICA North (USA-Canada-Mexico)
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More detailsSpecifications: System capable of 3" to 5" Cassette to Cassette 350 W Lamp UV-400 Exposure op Location : AMERICA North (USA-Canada-Mexico)
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More detailsFeatures: Accommodates wafers up to 8" 2 channel brightfield microscope Three position turret nos Location : AMERICA North (USA-Canada-Mexico)
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More detailsFeatures: Capable of wafers up to 8"/200mm Capable of working with wafer masks up to 9" x 9" Autom Location : AMERICA North (USA-Canada-Mexico)
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More detailsFeatures: Chamber size 155mm/6" ID Uses 57mm diameter disc targets Carbon evaporation power suppl Location : AMERICA North (USA-Canada-Mexico)
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More detailsSpecifications: 2"-3" Chuck and holder for 4 in. square mask 78 mm diameter of wafer exposure Pow Location : AMERICA North (USA-Canada-Mexico)
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More detailsSpecifications: Max wafer size: 5" diameter wafers Capable of Hard Contact, Soft Contact, and Proximi Location : AMERICA North (USA-Canada-Mexico)
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More detailsFeatures: Cassette to cassette operation SECS II/GEM Interface Fonts: SEMI OCR, BC412, and other d Location : AMERICA North (USA-Canada-Mexico)
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More detailsSpecifications: Microscope: dual zoom, CCD TV camera Alignment accuracy: 0.5 um top side Lamp powe Location : AMERICA North (USA-Canada-Mexico)
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More detailsFeatures: Split field camera system Mask alignment is performed by adjusting the X-Y and theta microme Location : AMERICA North (USA-Canada-Mexico)
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More detailsDescription: Atomic layer deposition system with load lock Any substrate up to 200 mm wafer Plasma Location : AMERICA North (USA-Canada-Mexico)
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More detailsStandard end effectors 2 cassette station swivel Cooling station Wafer aligner Robot with controller Temperatu Location : AMERICA North (USA-Canada-Mexico)
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More detailsFeatures: Autofeeder: single, cassette to cassette Backside wafer handling Specifications: Illumi Location : AMERICA North (USA-Canada-Mexico)
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More detailsFeatures: Three targets 5 in. x 15 in. Sputter etch capability Quartz substrate heaters, substrat Location : AMERICA North (USA-Canada-Mexico)
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More detailsAuto Feeder: Single, cassette to cassette, backside wafer handling Wafer size: Currently 5" (4" and 3" sizes a Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsYou can find used Wafer Equipment on Wotol
The main manufacturers of Wafer Equipment are KLA-Tencor, Karl Suss, Canon, Electroglas, Suss, Nikon, Semitool, TEL, Tokyo Semitsu Kogaku (TSK), Branson / IPC, MGI, Ultron, EVG, Allwin21, Abm, Accretech, ADE, AG Associates, AIO, Alessi, Applied Materials, ASM, ASML, Asyst Technologies, ATMI, Axcelis, Brooks Automation, Buehler, Cambridge, Cascade, Cascade Microtech, CDE (Creative Design Engineering), CEE, CHA, Control Micro Systems (CMS), Cymer, Dainippon Screen,Dektak, Denton, Disco, DNK, DNS, Dynapert, Dynatex, Electroglass, EV Group, Evergreen, Faith, Fluoroware, Fortrend Engineering, Gasonics, GCA, GSI Lumonics, Hitachi, HTG, IMT, InspecTech, Ionic Systems, Jeol, K & S, Kensington, KLA, Kokusai, LAM, Lam Research, Leica, Lintec, Loomis, Lumonics, Mactronix, Matsushita, Mech-El, Micro Automation, MRC, MTI, Nanometrics, Nitto, OAI, Olympus, Oriel, Oxford, Perkin Elmer, PRI, Prometrix, Recif SA, Rucker & Kolls, Suss MicroTec, SVG, Takatori, Tegal, Tencor, Tropel, Ultracision, Ultratech, Ulvac, Veeco, Verteq, Wentworth, Xynetics
The main model MPASeries, CDS-650CT, PLA-501F, MA-4100, NSR-1505G4, 1000, Titan II, MA150, 6033, 2029,2020,2025, 6200Series, SM200E, Step 200,UM810, UH-130, UF3000 EX, SFX100, M777, FPA-5500iZa, SR8220-019, Desktop 1, 270 SRD, ST-260, 1600-55, 8100XP, 8100Series, 1H-DX, KP-4200, MA-4201Series, MA-1006, L200,UH130M,DFM-M150, CEE 100, SP323, MJB3Series, JWSSeries, MA6Series, SWC4000, EX-5700, 2001X, MDA-60FA, 680A, 8300, ARM200CF, S-5200, S-4700, AS5000, Axiotron II, INS330, Axiospect 301, SF 600, WaferMark II,3308, MASeries, 20T2/150VPO, 860, 1600-55A, UH 102, 4000, Eureka 450, ETI0392A-6-U, 425130, ETII-6910B-X-V, EET1-0395D-X-U, ETII-6910B-X-V, F-6225, 827, 907, 211,UVSeries, AIT8010, eCD2, 8100XPR, CD-SEMSeries, 8250, PC 4400, 300405, SFS 6420, 6D, MM-Cascade 6100, MJB-55, 179884/ P-2 OPEN FRAME, 8300X, 4500, ATRM-2100, SWC11, MAS-8000,ATM-1100E, 3A, 90, RTP-600xp, UKA-650, SPP8, MP 2300, BH-BHM, 2066,AL100-L8, IDLW8R, REL-4500, IDLW8R, MAS-8000, Fix Load25, UKA-825, SCW111, ATRM-2100D, 4055/2, Optistation 3, REL-4500, ResMap 178, 8097, 1600-55m, LSD 100, DSL 10, H100, RHM-06, 908, UH-130, 600W, 100FX, RS 35, P16+, 8620, MA8/BA8 Gen3, lle-855SS, 85DD, SFS7700, 2300 Versys, ZX-1000, Mark7, S-7800HSA, 5610,ES3, M-GAUGE 200, AITI,SFS7200, THERMA-WAVE OP 2600, MA150, 2115, 9400, NGP80, 620, XRF3640, CTR-200, TREX 610, F-4225, EET10395-4-U, SYO-200SS, MS100, RS-75, 7400/18, 2001X 6, PLA-501FA, PS300 Parametric Serie 12, DX-III, SHS 1000VAC, V300-Si, 12", WM650, AlphaStep 300, SURFSCAN 7700, 903eSeries, F6000QS, SP1 TB1, Nanolab 600, NWL860-TMB-SP, F5, DSS200, RS35C, MX-50, DD-823V-8BL, MicroSense 6300, 2400, 4400,E5200, 8108, 600FA, 40, MRC 603, 7700, VersaPort 2200, R-3, SSEC M10, ST-270 SRD, L3510, HTC 8020, Lumonics III, 1800-6AR, HTC 4000, SSW-60A-AR, 1034X, WST 306, ST-860, KIS 2000, L3510E, 9350, PSM 6, 80B, RS-35, DR-8500 II, 301, VLR RIE LM/TM, 20T2/150VPO, 1034 XA – 6, 4085XSeries, 682A, 500R 120-1007, E8025S, 100 RIE, M6000L, EV CS50, 150, RC8, ATM-105-1-S-CE-S293, MPC3000, DMI4000B, 5100, F5x, P-10, LP-200H, F200, CMS1030, CW1002-6200RW, 8860, APM90A, 3001X, APM5000, 880
HS Code 8486 10 10 for Apparatus for rapid heating of semiconductor wafers.
HS Code 8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devicesde8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices