Used Semiconductor and PCB Manufacturing
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TYP A1 M/C Typ FC-9801F#1 SD/HD Typ Commandpost System Vers. MK8G2.38 Alarm File ALM00166.OEN Sp. Al.File AL00 Location : EUROPE (Western and Northern)
Price : On request
More detailsWire Bonders sold in Good working condition Can Power up Initial pass test, Year(s) : 2006 Location : EUROPE (Western and Northern)
Price : On request
More detailsESEC 2005 APLF Soft solder die bonder Still in production Line , Working condition Year(s) : 1987 Location : EUROPE (Western and Northern)
Price : On request
More detailsDie Bonder (E4) Year(s) : 1996 Location : EUROPE (Western and Northern)
Price : On request
More detailsBond Type Thermosonic Ball & Stitch Bond Force Range 20-200 grams X-Y Positioner Range 12" x 5" Axis (X,Y,Z) R Location : EUROPE (Western and Northern)
Price : On request
More details300mm inspection microscope for reflected and transmitted light inspection Nikon stage with 12" x 14" XY trave Year(s) : 2002 Location : EUROPE (Western and Northern)
Price : On request
More detailsUltra Micro Hardness Tester Model DUH 202 Location : EUROPE (Western and Northern)
Price : On request
More detailsWedge Wedge Wire Bonder Manual bonding ,but it is very good, and look like is very good, machine had caliber Location : EUROPE (Western and Northern)
Price : On request
More detailsBonder is complete and working condition Year(s) : 2014 Location : EUROPE (Western and Northern)
Price : On request
More detailsESEC 3006 F/X bonders - in working condition - no warranty Location : EUROPE (Western and Northern)
Price : On request
More detailsLike new condition Year(s) : 2001 Location : EUROPE (Western and Northern)
Price : On request
More detailsWAFER SIZE 6" Year(s) : 1996 Location : EUROPE (Western and Northern)
Price : On request
More detailsReflected light microscope configured for brightfield and darkfield inspection stage has 6x6 xy travel 5 pla Location : EUROPE (Western and Northern)
Price : On request
More detailsConfigured for Top Alignment Wafer Size: Small Pieces up to 4"/100mm Diameter Wafers Exposure Modes: Hard, So Year(s) : 2007 Location : EUROPE (Western and Northern)
Price : On request
More detailsDage 2400PC Wire Bond Pull/Ball Shear/Die Shear Tester w/ WP100 Load Cell This Dage 2400PC Wire Bond Pull/Bal Location : EUROPE (Western and Northern)
Price : On request
More detailsFaulty alignment camera. otherwise in good condition. powered down 2 years ago Year(s) : 2010 Location : EUROPE (Western and Northern)
Price : On request
More detailsVertical Quartz Tube Cleaner Model VQC-200 Location : EUROPE (Western and Northern)
Price : On request
More detailsKLA Candela CS 20 Wafer Inspection - 1 Phase - 50/60 Hz - 115 V 2007 Vintage Year(s) : 2007 Location : EUROPE (Western and Northern)
Price : On request
More detailsWafer Inspection Microscope Microscope Type Upright Microscope Configuration Brightfield Illumination Type Ref Year(s) : 2017 Location : EUROPE (Western and Northern)
Price : On request
More detailsAdvanced Wafer Inspection, 12" 2007 Vintage Year(s) : 2007 Location : EUROPE (Western and Northern)
Price : On request
More detailsWire bonder Model 1488.0 Year(s) : 1999 Location : EUROPE (Western and Northern)
Price : On request
More detailsStill installed in Nano Laboratory Year(s) : 2012 Location : EUROPE (Western and Northern)
Price : On request
More detailsComplete and in working condition Year(s) : 2008 Location : EUROPE (Western and Northern)
Price : On request
More detailsWire Bonders (U22) (U21) Year(s) : 1995 Location : EUROPE (Western and Northern)
Price : On request
More detailsOrthodyne 360B Heavy wire bonder Y1991 5 to 20 mils (Sold) Orthodyne 360B Wire bonder Y1991 1mil (Available as Year(s) : 1991 Location : EUROPE (Western and Northern)
Price : On request
More detailsUsed Semiconductor and PCB Manufacturing for sale
You will find machines for the manufacturing of the electronic chips and their assembly on printed circuit boards (PCB).
Semiconductors market have exceeded 500 billion usd in 2019. It covers memory devices, logic devices, analog IC, MPU, power devices, MCU, sensors, that will be used in an increasing number of applications such as computers, mobile phones, all electronic appliances, electronic in aotomotive industry, machinery and many more.
Once the semiconductors are manufactured they are assembled on the PCBs and main machines needed for this purpose are pick and place machines, sodering owen, secreen printing machines for solder paste, dispensers for glues.
This industry is largely located in Asia and expecially in China.
The main manufacturers machine are Mydata, Universal, Juki, Panasonic, Fuji, Samsung, Manncorp, Siemens, ASM, Quad, Assembleon, Universal Instruments, Europlacer, Philips, Advantest, AG Associates, Agilent, AMAT, Anritsu, Applied Materials, Aqueous Technologies, ASM, Asymtek, ASYSBausch & Lomb, Blue M, Branson, Branson / IPC, BTU, Camalot, Canon, CTI,Dage, DEK, Despatch, Disco, DNS, DynaPace, Ebara, Edwards, Ekra, Electro Design, Electroglas, Electrovert, Ersa, Esec, EVG, Gasonics, Heller, Hewlett Packard (HP), Hitachi, Jot, K & S, Kanetic, Karl Suss, Keithley, Keysight, KLA-Tencor, LAM, Leica, Leybold, Lynx, Mania, Matheson, Mirtec, MPM, Nanometrics, Nikon, NuTek, Olympus, Oxford, Plasmatherm, Rohde & Schwarz, Rudolph, Schmid, Seho, Semitool, Simplimatic, SMT, Speedline, Suss, Technics, Tegal, Tektronix, TEL, Tencor, Tenney, Teradyne, Thermotron, Tokyo Semitsu Kogaku (TSK), Varian, Veeco, Venntek, Verteq, Vitronics, Vitronics Soltec, VWR, West Bond, YESTech, Yield Engineering Systems (YES)
The main model my12, TX2i SIPLACE, Mydata My200SX-14, KE-2050L, MY9, GSM2 4681A, Topax XII, CP40V, 730L, TX2i, SL940E, XP243E, 4982, MY15, MC389CY-F3-V, Siplace CA4, YG100-RB, MY100SXe-14