Used Semiconductor and PCB Manufacturing
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atmospheric wafer robot( DNS SU-3100) Version: 300 mm Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsMirtec MV7U Inline AOI - 2011 DOM: 2/18/2011 SW: Mirtec Inspector 4.5.6.0 OS: Windows XP 5 Cameras: - 1 top Year(s) : 2011 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsERSA Versaflow 50/60 In Line Selective Solder DOM: 04/2010 SW rev: 3.028.001 Alloy run: Sn96 RoHS In use and Year(s) : 2010 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsSpecs Mech. refrigeration Width - in. 39 Depth - in. 39 Height - in. 39 Temperature Range -70°C to 180°C Te Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsDriller, 2 head, X-Y-Z linear driven, CNC S50, Spindles 160K Rpm, Laser Depth controll, Quick drill, Drill b Year(s) : 2006 Location : EUROPE (Western and Northern)
Price : On request
More detailsLoader Overall length 650mm Width 1050 mm and hight 1330 mm Minimum board size 200 x 200 mm Maximum board siz Year(s) : 2006 Location : EUROPE (Western and Northern)
Price : On request
More detailsEuroplasma etch unit CD1000 PCB PLC year 2011. Year(s) : 2011 Location : EUROPE (Western and Northern)
Price : On request
More detailsWafer Mask Inspection Parts Machine KLA ES32 (1) - Stage, electron source, feed throughs included KLA ES32 (2) Year(s) : 2005 Location : EUROPE (Western and Northern)
Price : On request
More detailsWAFER SIZE 150mm Year(s) : 2001 Location : EUROPE (Western and Northern)
Price : On request
More detailsMetrology Model Prometrix UV-1050 Location : EUROPE (Western and Northern)
Price : On request
More detailsIntegrated Metrology System Model 9010bVIS Year(s) : 2002 Location : EUROPE (Western and Northern)
Price : On request
More detailsThe NanoSpec 6100 is a fast, reliable, low cost tabletop film thickness and mapping system that provides a br Location : EUROPE (Western and Northern)
Price : On request
More detailsBatch Forced Convection Reflow Oven Maximum Temperature 300 ºC (572 ºF, 573 ºK) Other Information Four Zone Location : EUROPE (Western and Northern)
Price : On request
More detailsCondition: “As is” Date of manufacture: 2004 Wafer size 300mm Software revision : 3,280ST000 Year(s) : 2004 Location : EUROPE (Western and Northern)
Price : On request
More detailsSold in Good working Condition Location : EUROPE (Western and Northern)
Price : On request
More detailsAUTO WAFER MOUNTER SYSTEM MODEL RAD-2500F/12 Year(s) : 2004 Location : EUROPE (Western and Northern)
Price : On request
More detailsRotary Bonder Model 360B Year(s) : 2002 Location : EUROPE (Western and Northern)
Price : On request
More detailsDage 2400A sold in working condition Wire Pull and Ball Shear Modules availabe Location : EUROPE (Western and Northern)
Price : On request
More detailsDie Bonder (3 Sets) Wafer Size 200mm Location : EUROPE (Western and Northern)
Price : On request
More detailsApplied Materials Axiom HT plus Axiom HT+ strip chamber Year(s) : 2007 Location : EUROPE (Western and Northern)
Price : On request
More detailsFully Automatic Dicing Saw Status: excellent Application: Dicing/Cutting/Slotting various wafers X - axis Sec Location : EUROPE (Western and Northern)
Price : On request
More detailsFully Automatic Dicing Saw Status: excellent Application: Dicing/Cutting/Slotting various wafers X - axis Sec Location : EUROPE (Western and Northern)
Price : On request
More detailsLike New Including Heated work Holder Year(s) : 2023 Location : EUROPE (Western and Northern)
Price : On request
More detailsfilm thickness from 100A to 50 microns Upgraded to new Olympus MS Plan infinity corrected 5x/10x/50x objective Location : EUROPE (Western and Northern)
Price : On request
More detailsMax. workpiece size: 8"/ square die 200mm X-axis: Cutting range: 210mm Cutting speed: 0.1 ~ 300m/s Y-axis: Year(s) : 2018 Location : EUROPE (Western and Northern)
Price : On request
More detailsUsed Semiconductor and PCB Manufacturing for sale
You will find machines for the manufacturing of the electronic chips and their assembly on printed circuit boards (PCB).
Semiconductors market have exceeded 500 billion usd in 2019. It covers memory devices, logic devices, analog IC, MPU, power devices, MCU, sensors, that will be used in an increasing number of applications such as computers, mobile phones, all electronic appliances, electronic in aotomotive industry, machinery and many more.
Once the semiconductors are manufactured they are assembled on the PCBs and main machines needed for this purpose are pick and place machines, sodering owen, secreen printing machines for solder paste, dispensers for glues.
This industry is largely located in Asia and expecially in China.
The main manufacturers machine are Mydata, Universal, Juki, Panasonic, Fuji, Samsung, Manncorp, Siemens, ASM, Quad, Assembleon, Universal Instruments, Europlacer, Philips, Advantest, AG Associates, Agilent, AMAT, Anritsu, Applied Materials, Aqueous Technologies, ASM, Asymtek, ASYSBausch & Lomb, Blue M, Branson, Branson / IPC, BTU, Camalot, Canon, CTI,Dage, DEK, Despatch, Disco, DNS, DynaPace, Ebara, Edwards, Ekra, Electro Design, Electroglas, Electrovert, Ersa, Esec, EVG, Gasonics, Heller, Hewlett Packard (HP), Hitachi, Jot, K & S, Kanetic, Karl Suss, Keithley, Keysight, KLA-Tencor, LAM, Leica, Leybold, Lynx, Mania, Matheson, Mirtec, MPM, Nanometrics, Nikon, NuTek, Olympus, Oxford, Plasmatherm, Rohde & Schwarz, Rudolph, Schmid, Seho, Semitool, Simplimatic, SMT, Speedline, Suss, Technics, Tegal, Tektronix, TEL, Tencor, Tenney, Teradyne, Thermotron, Tokyo Semitsu Kogaku (TSK), Varian, Veeco, Venntek, Verteq, Vitronics, Vitronics Soltec, VWR, West Bond, YESTech, Yield Engineering Systems (YES)
The main model my12, TX2i SIPLACE, Mydata My200SX-14, KE-2050L, MY9, GSM2 4681A, Topax XII, CP40V, 730L, TX2i, SL940E, XP243E, 4982, MY15, MC389CY-F3-V, Siplace CA4, YG100-RB, MY100SXe-14