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Used Semiconductor Equipment

4,798 results
1

WAFER GROOVER/SECTIONER Location : AMERICA North (USA-Canada-Mexico)

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Completely Rebuilt 200mm dicing saw. This saw is capable of cutting 8″ wafers (200mm) on film frames. It is of Location : AMERICA North (USA-Canada-Mexico)

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SEMIAUTOMATIC SCRIBER Location : AMERICA North (USA-Canada-Mexico)

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auto indexing, includes microscope Location : AMERICA North (USA-Canada-Mexico)

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12 inch WAFER PROBE SYSTEM Location : AMERICA North (USA-Canada-Mexico)

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2001X 8 inch WAFER PROBE SYSTEM Location : AMERICA North (USA-Canada-Mexico)

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2000 Dry Plasma Etcher Asher, Plasma Cleaner System Location : AMERICA North (USA-Canada-Mexico)

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7700E-79 Thermosonic Ball to Wedge Wire Bonder. Wedge Wire Bonder Bonds gold wires ranging from 0.0007” to 0.0 Location : AMERICA North (USA-Canada-Mexico)

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3″ AIR BEARING DICING SAW, INCLUDES MICROSCOPE Location : AMERICA North (USA-Canada-Mexico)

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Meas: PL Mapper/2-4in Year(s) : 2010 Location : ASIA (North East)

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oth: Wire pull Tester Location : ASIA (North East)

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AOI suitable for inner- and outer layers, still in production on shopfloor Year(s) : 2005 Location : EUROPE (Western and Northern)

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XD7500VR 160 KVa Open Tube X-ray System Location : AMERICA North (USA-Canada-Mexico)

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Plasma Etch along with Leybold Trivac D16B Vacuum Pump Location : AMERICA North (USA-Canada-Mexico)

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PX-250 Plasma Asher Etcher w/ Seren IPS R300 13.56MHz RF Location : AMERICA North (USA-Canada-Mexico)

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Configuration and Wafer Size: One chamber with one Equipe PRI ATM-104-1 robot and ESC-200 controller; Location : AMERICA North (USA-Canada-Mexico)

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Asher Year(s) : 1984 Location : ASIA (North East)

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- 2D AOI - Camera: 8 M Pixels - Resolution: 4,75 micro mètre - PCB dimensions: 50 mm x 50 mm up to 355 mm x 35 Year(s) : 2014 Location : EUROPE (Western and Northern)

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Wafer Inspection Tool Year(s) : 2006 Location : AMERICA North (USA-Canada-Mexico)

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- Wafer Substrate Bonder - Single Station Wafer Bonder - Used For temporary Wax Mounting of Semiconductor Wafe Year(s) : 1999 Location : AMERICA North (USA-Canada-Mexico)

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Heavy Wire Bonder Location : EUROPE (Western and Northern)

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Wire Bonder Location : EUROPE (Western and Northern)

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- Windows based with Suss AL 900 / Autoalign System - Alignment System MA200e TSA - PC -Aut. Adjustment ( Cog Year(s) : 1999 Location : AMERICA North (USA-Canada-Mexico)

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- Current Gas Configuration: H2, O2, N2, Ar, CF4, SF6, CHF3, He, CH4, Cl2 and BCl3 - Cryo Table w/ operatering Year(s) : 2009 Location : AMERICA North (USA-Canada-Mexico)

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709/703 hot gas bonder Includes: New touch screen with recipes Timed parameters: pre scrub, scrub and post sc Location : AMERICA North (USA-Canada-Mexico)

Price : On request

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You can find used Semiconductor Equipment on Wotol

For second hand Semiconductor Equipment we have Wafer Equipment, Wafer Handler & Robots, CVD Equipment, Wet Bench, Lithography & Photoresist, Plasma Etcher / Asher, Dicer & Scriber, Grinding, Lapping & Polishing, Component Counters/Tapers, Dry Pump, Bonder, Metrology and inspection equipment. The main manufacturers for used Semiconductor Equipment are KLA-Tencor, Plasmatherm, AMAT, TEL, Disco, Karl Suss, Canon, Semitool, Hitachi, Nanometrics, Nikon, Applied Materials, Tegal, Varian.

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