Used Semiconductor Equipment

Description: Exhaust management gas scrubber BOC EDWARDS BOC EDWARDS Longdescription: Equipment Details: Ex Year(s) : 2004 Location : EUROPE (Western and Northern)

Price : On request

Description: Inspection microscopes microscopes microscopes microscopes Longdescription: Inspection microsc Location : EUROPE (Western and Northern)

Price : On request

Description: for Wafer Size: 4"- 6" Coater systems, 4"-6" (3) Zone hotplate Single / double cassette Fluorow Location : EUROPE (Western and Northern)

Price : On request

description: - the laser is alive it is built for 110V, but we have a generator Year(s) : 2000 Location : EUROPE (Western and Northern)

Price : On request

Description: -Tooling for 6" Wafer inclusive Bond Chuck and Pressure Insert -Capable of fusion compression b Year(s) : 2004 Location : EUROPE (Western and Northern)

Price : On request

Manufacturer: FriesResearch & Technologie GmbH The MicroProf ® is the universal surface metrology tool for q Year(s) : 2014 Location : EUROPE (Western and Northern)

Price : On request

• System Type: manual probe system • Application: DC testing • Application: CV-IV testing • Application: high- Location : AMERICA North (USA-Canada-Mexico)

Price : On request

• Deposition Sources: two low-voltage thermal evaporation sources • Pump Type: built-in turbo molecular pump • Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Wedge-wedge, Bondhead 60° e-box Year(s) : 2019 Location : EUROPE (Western and Northern)

Price : On request

GOCu-Ball Bonder Year(s) : 2016 Location : EUROPE (Western and Northern)

Price : On request

CU kit Copper Bonder Year(s) : 2016 Location : EUROPE (Western and Northern)

Price : On request

Wedge-wedge, Bondhead 60° e-box Vers. 2 Year(s) : 2014 Location : EUROPE (Western and Northern)

Price : On request

- Manual wafer load plasma asher - Designed for Wafer Cleaning and Descum - Plasma Chamber: Quartz - Location : AMERICA North (USA-Canada-Mexico)

Price : On request

- Topside Alignment - Cassette to Cassette Operation - Can be used in either Automatic or Manual Mode - Auto Location : AMERICA North (USA-Canada-Mexico)

Price : On request

2200 EVO (Gen1) Bonder Year(s) : 2011 Location : EUROPE (Western and Northern)

Price : On request

2200 EVO (Gen2) Bonder Year(s) : 2014 Location : EUROPE (Western and Northern)

Price : On request

2200 EVO+ Bonder Year(s) : 2019 Location : EUROPE (Western and Northern)

Price : On request

Equipment according the age in good in good shape, however only one wafer stage is currently working 2003: "A Year(s) : 2003 Location : EUROPE (Western and Northern)

Price : On request

Exterior Dimensions Width 16.000 in (40.6 cm) Depth 21.000 in (53.3 cm) Height 32.000 in (81.3 cm) Weight 108 Year(s) : 2006 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Wafer Size Range Minimum 50 mm Maximum 200 mm Process DRIE PECVD Controller Type PC Controller Type End Point Year(s) : 2001 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

• Wafer Size Minimum: 50 mm • Wafer Size Maximum: 200 mm • Set Size: 100 mm • Number of Chambers: 1 • Process Year(s) : 1999 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Ozone Gas Module 8407 Ozone Generator Other Information MKS Part #: 12-14100-01300-4M00 Includes (See Photos Location : AMERICA North (USA-Canada-Mexico)

Price : On request

BJ920 Wedge Bonder Location : EUROPE (Western and Northern)

Price : On request

Smema; Duples slide fluxer; Ionizer pick: BQC; WMP: Host; Substrate Handler SDH-84fc; SP84 speed; PXRAY; refu Year(s) : 2013 Location : EUROPE (Western and Northern)

Price : On request

Die Bonder Semi Auto Amadyne SAM42 Wafer teble with Ejector: Fluxer; Backside Cam: Tool Holder; Year(s) : 2013 Location : EUROPE (Western and Northern)

Price : On request