Used Semiconductor Equipment

Equipment Make: KLA-Tencor Equipment Model: SP 1-Classic Type: Inspection Machine Wafer Size: 6" to 8" Equipme Location : EUROPE (Western and Northern)

Price : On request

Defect Inspection system Model INS 3000 Sold As Is Location : EUROPE (Western and Northern)

Price : On request

Complete and working condition Still installed Year(s) : 1992 Location : EUROPE (Western and Northern)

Price : On request

Board Inspection Model 6055-II AOI Year(s) : 2005 Location : EUROPE (Western and Northern)

Price : On request

Working condition Vi Technology Model Vi 3K2 Vintage 2006 Year(s) : 2006 Location : EUROPE (Western and Northern)

Price : On request

Board Inspection Test Model S3054QS Year(s) : 2004 Location : EUROPE (Western and Northern)

Price : On request

4mega camera 8 way projection includes Review station computer. - Optional (not included) : Offline Teaching Year(s) : 2013 Location : EUROPE (Western and Northern)

Price : On request

Digital Instruments Nanoscope III Scanning Probe Microscope Location : EUROPE (Western and Northern)

Price : On request

Type: Laser Equipment Configuration: 2008 Vintage Year(s) : 2008 Location : EUROPE (Western and Northern)

Price : On request

200mm As-is KLA / MicroSense UMA-C200-STR Thin Film Stress Measurement System consisting of: - Vintage: Appro Year(s) : 2019 Location : EUROPE (Western and Northern)

Price : On request

PLASMATHERM ODYSSEY HDRF ASHER consisting of: - Model: Odyssey HDRF - Configured for 150mm wafers - 2 Chambers Location : EUROPE (Western and Northern)

Price : On request

Manufacturer: ESEC Type: Smart Card Wire Bonder Model: ESEC 3100 SCplus Location : EUROPE (Western and Northern)

Price : On request

6 inch vintage: 1995 As-is condition Complete with no missing parts Working condition before decommissioned P Year(s) : 1995 Location : EUROPE (Western and Northern)

Price : On request

Tool Status Connected Wafer Size NA Fab Section Failure Analysis Asset Description Zeiss Merlin Scanning Ele Year(s) : 2010 Location : EUROPE (Western and Northern)

Price : On request

Common Features of All 7500 Series Systems • Compact benchtop design permits easy integration into existing la Year(s) : 2010 Location : EUROPE (Western and Northern)

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Condition: good Exterior Dimensions Width 27.559 in (70.0 cm) Depth 27.559 in (70.0 cm) Height 76.3 Year(s) : 2004 Location : EUROPE (Western and Northern)

Price : On request

Condition Refurbished S-1160B-4N Precision Manual Analytical Probe Station configured with 4" chuck upgradable Location : EUROPE (Western and Northern)

Price : On request

This West-Bond West-Bond 7372B Convertible Die Bonder can be converted between a 7200B Epoxy Die Bonder, and Location : EUROPE (Western and Northern)

Price : On request

PECVD 80+ SiO2 Dep Non-functional tool but can be repaired (requires Silane MFC) Designed for 4” wafers but ca Location : EUROPE (Western and Northern)

Price : On request

This West-bond 7400A Manual Ultrasonic/ Thermosonic 45° Feed Wedge-Wedge Wire Bonder looks to be in good cosm Location : EUROPE (Western and Northern)

Price : On request

Three MaxumPlus Bonders upgraded by KNS from Maxum. Year(s) : 2004 Location : EUROPE (Western and Northern)

Price : On request

Condition: very good Yushin Demounter 1 3Teile Glas Demount Tool for 6 and 8 inch Wafer. Glas Output Statio Year(s) : 2006 Location : EUROPE (Western and Northern)

Price : On request

Mask & Wafer Inspection Working condition Year(s) : 2008 Location : EUROPE (Western and Northern)

Price : On request

Eye Piece: SWH10 x /26.5 Objective lens: MpanFLN x5 x10 x20 Working Condition Year(s) : 2015 Location : EUROPE (Western and Northern)

Price : On request

This West-Bond 7200CR Dual Head Pick & Place Epoxy Die Bonder looks to be in good cosmetic condition, showing Location : EUROPE (Western and Northern)

Price : On request