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Used Semiconductor Equipment

4,798 results
1

Details: Powerful 3D sensor technology for quality control from below Shadow-free results by using eight angle Year(s) : 2016 Location : AMERICA North (USA-Canada-Mexico)

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Facilities: 110VAC 50/60Hz, 15A & 30 PSI min. Dims: 55” x 57” x 50” @ 2,000 lbs Specifications Inspection Cap Location : AMERICA North (USA-Canada-Mexico)

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10

Brightfield Wafer Defect Inspection System Version: 200 mm Excellent condition Still in the cleanroom, can be Year(s) : 2004 Location : AMERICA North (USA-Canada-Mexico)

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Microscope Location : ASIA (North East)

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Microscope Location : ASIA (North East)

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Brand: Ismeca D2 Tape & reel for D2 pack Location : EUROPE (Western and Northern)

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Brand: GS GS HM 1800 Laser Marker on L/F TO 220 EO,Magazine to Magazine Location : EUROPE (Western and Northern)

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Brand: EO Technic EO Technic Laser Marker Laser Marker on L/F TO 220 EO,Magazine to Magazine Location : EUROPE (Western and Northern)

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Tesec 8714 Laser Marker, System Six Handler and laser marker(Lumonics system Six) Location : EUROPE (Western and Northern)

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Delvotec 6834.00.1125 For TO 220 leadframe Location : EUROPE (Western and Northern)

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Brand: Beckman Beckman L8 - 60 MR Centrifuge (169) Location : EUROPE (Western and Northern)

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Brand: Micro Autom Micro Autom. M 1006 Dicing Saw (384) Location : EUROPE (Western and Northern)

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Xynetics-Electroglas 1034 XA - 6 Automatic Wafer Prober (171) , 6" XY-table, 6" chuck Location : EUROPE (Western and Northern)

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Karl Suss MJB 21 Mask Aligner (118) , Basic machine up to 3" Si wafer, 2" in our configuration Location : EUROPE (Western and Northern)

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Canon PLA - 501 FA Mask Aligner (104) , 3" wafer Location : EUROPE (Western and Northern)

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Canon PLA - 501 FA Mask Aligner (103) , 3" wafer Location : EUROPE (Western and Northern)

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Esec 2004W - 157 Die Bonder (242) , TO-220 Location : EUROPE (Western and Northern)

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Esec 2004W - 156 Die Bonder (243) , TO-220 Location : EUROPE (Western and Northern)

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Esec 6" ADP, AWL, in.Top Stack Loader, out.MH, Epoxy Disp. 2006 Die Bonder (110) Location : EUROPE (Western and Northern)

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Esec 2006 Die Bonder (109) , 4" ADP, AWL, in. MH, out. MH, Epoxy Disp. SD Location : EUROPE (Western and Northern)

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Esec Die Bonder (111) , 4" ADP, AWL, input MH, output MH 2004 Location : EUROPE (Western and Northern)

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Alphasem DB 607 Die Bonder (165) , for ceramic package Location : EUROPE (Western and Northern)

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1

Microscope Location : ASIA (North East)

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Microscope Location : ASIA (North East)

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Microscope: Metallographic Year(s) : 2020 Location : ASIA (North East)

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You can find used Semiconductor Equipment on Wotol

For second hand Semiconductor Equipment we have Wafer Equipment, Wafer Handler & Robots, CVD Equipment, Wet Bench, Lithography & Photoresist, Plasma Etcher / Asher, Dicer & Scriber, Grinding, Lapping & Polishing, Component Counters/Tapers, Dry Pump, Bonder, Metrology and inspection equipment. The main manufacturers for used Semiconductor Equipment are KLA-Tencor, Plasmatherm, AMAT, TEL, Disco, Karl Suss, Canon, Semitool, Hitachi, Nanometrics, Nikon, Applied Materials, Tegal, Varian.

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