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Used Semiconductor Equipment

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1

eScan 500, sn: ML07114, Defect Review, 300mm Tool ID: SEI2703 Year(s) : 2014 Location : AMERICA North (USA-Canada-Mexico)

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HP & Sulfuric Ozone FullFlow 1/99 8100, s/n: Cont 1 1188, 200mm, Tool ID: 67R88V Year(s) : 1999 Location : AMERICA North (USA-Canada-Mexico)

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300mm, S/N PN00453 Tool ID: PROMOS_1158/082 Year(s) : 2004 Location : AMERICA North (USA-Canada-Mexico)

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Wafer Inspection Tool Year(s) : 2006 Location : AMERICA North (USA-Canada-Mexico)

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TEL Lithius, sn: MDG160683, ,300 mm Year(s) : 2006 Location : AMERICA North (USA-Canada-Mexico)

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P12XLn prober Year(s) : 2008 Location : AMERICA North (USA-Canada-Mexico)

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GPD CF-7 Axial Cut and Bend Former Location : AMERICA North (USA-Canada-Mexico)

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Porta300P, 2 loadports Year(s) : 2011 Location : AMERICA North (USA-Canada-Mexico)

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Cut samples from wafers Year(s) : 2016 Location : AMERICA North (USA-Canada-Mexico)

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Tactrus NCCP, 300mm, Etch Connected in fab with 2 chms. Year(s) : 2010 Location : AMERICA North (USA-Canada-Mexico)

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RSR160, Reticle Handler Location : AMERICA North (USA-Canada-Mexico)

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Brightfield inspection Location : AMERICA North (USA-Canada-Mexico)

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150mm Manual Analytical Wafer Prober. Vacuum Chuck: 6” dia. (150mm). Manual XY stage movement: 6” X x 6” Y. P Location : AMERICA North (USA-Canada-Mexico)

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Speed range: 6000 to 18000rpm Feed size: up to 10mm Final fineness: <40μm (based on feed material) Location : AMERICA North (USA-Canada-Mexico)

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Hybond 626 Multipurpose Digital Thermosonic Wire Bonder, Ball Bonder, Wedge Bonder, Bump or Stud Bonder, Peg Location : AMERICA North (USA-Canada-Mexico)

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SLR ICP Shuttle Lock ICP Inductively Coupled Plasma Etch System. PC controller. Vacuum load lock with wafer tr Location : AMERICA North (USA-Canada-Mexico)

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Oubel OB-T02 Semi-Automatic SMD Taping Machine. Hot seal or self-adhesive taping. Mitsubishi PLC+7 inch touch Location : AMERICA North (USA-Canada-Mexico)

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Steag (AG Associates) Heatpulse 610 RTP Rapid Thermal Processing System. Manually loaded and capable of proce Location : AMERICA North (USA-Canada-Mexico)

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Accuthermo AW610 Rapid Thermal Processor. The AccuThermo AW610 is a rapid thermal processing (RTP) system, wh Location : AMERICA North (USA-Canada-Mexico)

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WEST BOND 747677E-79C Combination Bonder capable of Ball Bonding and Wedge Bonding. Bonder comes with two bond Location : AMERICA North (USA-Canada-Mexico)

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150S Nomarski 1000X Microscope. Microscope has Nomarski optics on all objectives except for the 5X. Objectives Location : AMERICA North (USA-Canada-Mexico)

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4522 Manual Gold Ball Wire Bonder With heated work holder. For process development, production, research or ad Location : AMERICA North (USA-Canada-Mexico)

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4524 Manual Gold Ball Bonder. Versatile production capabilities for bonding applications from simple to discre Location : AMERICA North (USA-Canada-Mexico)

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PWM32-PS-R790 Photoresist Spinner. Location : AMERICA North (USA-Canada-Mexico)

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Manual Analytical Wafer Probe Station. Wafer prober designed to support a broad range of precision probing ap Location : AMERICA North (USA-Canada-Mexico)

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You can find used Semiconductor Equipment on Wotol

For second hand Semiconductor Equipment we have Wafer Equipment, Wafer Handler & Robots, CVD Equipment, Wet Bench, Lithography & Photoresist, Plasma Etcher / Asher, Dicer & Scriber, Grinding, Lapping & Polishing, Component Counters/Tapers, Dry Pump, Bonder, Metrology and inspection equipment. The main manufacturers for used Semiconductor Equipment are KLA-Tencor, Plasmatherm, AMAT, TEL, Disco, Karl Suss, Canon, Semitool, Hitachi, Nanometrics, Nikon, Applied Materials, Tegal, Varian.

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