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Used Semiconductor Equipment

4,798 results
1

Can be set up for dotting or dispense epoxy Year(s) : 2019 Location : EUROPE (Western and Northern)

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Die Bonder Model MCM-12 Year(s) : 2011 Location : EUROPE (Western and Northern)

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good condition Location : EUROPE (Western and Northern)

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Will be sold in refurbished condition Year(s) : 2000 Location : EUROPE (Western and Northern)

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Nitto De-Taper, sold in working condition Year(s) : 1999 Location : EUROPE (Western and Northern)

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TEL Mark-7 Track 2C 3D installed as is where is 50% down, and 50% prior to deinstall Location : EUROPE (Western and Northern)

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1

SOG Spin Coat L Configuration - Load on the Left, Cure Furnace on the Right 25 Slot Cassette Oven type: (4) H Year(s) : 2015 Location : EUROPE (Western and Northern)

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1

Main Controller Type: NA Wafer Flow: Right to Left Co Year(s) : 2004 Location : EUROPE (Western and Northern)

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Full setup with Camera, Monitor, Heated work holder, microscope, light source for microscope. Setup was remo Location : EUROPE (Western and Northern)

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Wire Bonder Model Maxum Location : EUROPE (Western and Northern)

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Working condition Location : EUROPE (Western and Northern)

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Bonders Model EAGLE AERO Year(s) : 2018 Location : EUROPE (Western and Northern)

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This Orthodyne 20 Ultrasonic Heavy Wire Bonder with Wire Dereeler looks to be in good cosmetic condition, sh Location : EUROPE (Western and Northern)

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This K&S (Kulicke & Soffa) model 4124 Manual Gold Ball Wire Bonder looks to be in good cosmetic condition, sh Location : EUROPE (Western and Northern)

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Wire Bonders Model Eagle Xtreme Year(s) : 2012 Location : EUROPE (Western and Northern)

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Kulicke and Soffa (K&S) 4123 Wire Bonder General Specs: Wire Diameter Range : Gold - 0.5 to 3.0 mils (12.7 to Location : EUROPE (Western and Northern)

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This K&S (Kulicke & Soffa) model 4124 Manual Gold Ball Wire Bonder looks to be in good cosmetic condition, sho Location : EUROPE (Western and Northern)

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1

- Model: ABC200 - MHU - Main Handling Unit w/ Genmark GB8 Robot - Module 1: BA200 – Bond Aligner - Module 2: N Location : EUROPE (Western and Northern)

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1

A MXP ETCH B MXP ETCH C MXP ETCH Good Condition Year(s) : 1997 Location : EUROPE (Western and Northern)

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1

Type: ICP HR Etch System Wafer Size: 8" Location : EUROPE (Western and Northern)

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1

Dual etch chamber system with handler Model 602E Year(s) : 2002 Location : EUROPE (Western and Northern)

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1

Wire Bonder Model Eagle 60 Year(s) : 2007 Location : EUROPE (Western and Northern)

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Includes Hesse DA 04 051 Deep Access Bondhead & Light Tower; Number of Bonds Approx 37,054,610; Dimensions o Year(s) : 2009 Location : EUROPE (Western and Northern)

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1

7 sets ASM Harrier Bonders Vintage 2009~2010 Working condition Year(s) : 2009, 2010 Location : EUROPE (Western and Northern)

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1

This West-Bond 545657B is a Semi-Automatic Three-Way Convertible 45° Wire Feed Wedge, 90° Wire & Ribbon Feed Location : EUROPE (Western and Northern)

Price : On request

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You can find used Semiconductor Equipment on Wotol

For second hand Semiconductor Equipment we have Wafer Equipment, Wafer Handler & Robots, CVD Equipment, Wet Bench, Lithography & Photoresist, Plasma Etcher / Asher, Dicer & Scriber, Grinding, Lapping & Polishing, Component Counters/Tapers, Dry Pump, Bonder, Metrology and inspection equipment. The main manufacturers for used Semiconductor Equipment are KLA-Tencor, Plasmatherm, AMAT, TEL, Disco, Karl Suss, Canon, Semitool, Hitachi, Nanometrics, Nikon, Applied Materials, Tegal, Varian.

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