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Used Semiconductor and PCB Manufacturing

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- PCT Systems Megasonic Hyperclean Controller - 2 Foot Pedals - 2 Goosenecks - 47" x 26" x 3" Parts Cleaning B Year(s) : 2007 Location : AMERICA North (USA-Canada-Mexico)

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- MHU - Main Handling Unit w/ Genmark GB8 Robot - Module 1: BA200 – Bond Aligner - Module 2: NP200 – Plasma Ac Location : AMERICA North (USA-Canada-Mexico)

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- Operational - Lots of Extra Spare Parts Location : AMERICA North (USA-Canada-Mexico)

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- Fully Operational - Comes w/ Spare Parts - Operations Manual Location : AMERICA North (USA-Canada-Mexico)

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Max Wafer: 200mm System Dimensions: 23 x 32 x 60 inches Configuration: 8" wafer capable, single chamber Location : AMERICA North (USA-Canada-Mexico)

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- Dimensions: 4ft (width) x 6ft 8in (height) x 5.5ft (depth) - Material: White Polypropylene - Qty 4 Baths Location : AMERICA North (USA-Canada-Mexico)

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- Single PECVD chamber, non load-locked - Input Power: 208V, 3ph - Heated Platen up to 400 C - Max Wafer Size Location : AMERICA North (USA-Canada-Mexico)

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Max Wafer: 200mm System Dimensions: 74x34x71 Configuration: 200mm platen, Load-locked single chamber, Ch Location : AMERICA North (USA-Canada-Mexico)

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- Wafer sizes: 100mm, 150mm, and 200mm - Thin film measurement tool - Broadband UV optics - Dual beam spectrop Location : AMERICA North (USA-Canada-Mexico)

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- Load Locked Chamber - Carrier Plate to run batches of (qty 4) 150mm wafers per run - Carrier Plate to run b Year(s) : 2006 Location : AMERICA North (USA-Canada-Mexico)

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Max Wafer: 150mm Configuration: Electroplating Wet Bench, manual wafer loading, currently configured for 6 Year(s) : 2009 Location : AMERICA North (USA-Canada-Mexico)

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- Manual wafer load substrate bonder - Capable of fusion compression bonding - Capable of thermal compression Location : AMERICA North (USA-Canada-Mexico)

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- Manual Mask Aligner - Topside Alignment (TSA) - Automatic Alignment - Up to 6"/150mm Wafer Capable (with pro Year(s) : 2004 Location : AMERICA North (USA-Canada-Mexico)

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- Substrate Size Up To 4" - Max Temperature: 1100°C - Base Pressure:<10 - Process Gases: Argon, Hydrogen, Meth Year(s) : 2011 Location : AMERICA North (USA-Canada-Mexico)

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- Long Scan Surface Profilometer - Wafer Size: 8"/200mm - S/N: 1090-0420 Location : AMERICA North (USA-Canada-Mexico)

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- Dual Function (Prime / Reversal) - Up to 200 Degrees Celsius - Chamber Dimensions 16” x 16” x 16” - 8 Heater Location : AMERICA North (USA-Canada-Mexico)

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Fully refurbished to like-new condition, including 1 year warranty, professional installation, and also proce Location : AMERICA North (USA-Canada-Mexico)

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<b>1x, KLA-Tencor, 2138XP Surface Inspection System</b> - Currently Setup for Processing 8"/200mm Wafers - L Location : AMERICA North (USA-Canada-Mexico)

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Wafer Size 8" Vintage - . Scans samples up to 8 inch . Little or no sample preparation for increased produc Location : ASIA (North East)

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System Measurement Performance Spreading Resistance Dynamic Range : 1Ω to > 10Ω Reistivity : 10-⁴~ 4x10⁴Ωcm Co Year(s) : 2004 Location : ASIA (North East)

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[ General Description ] Wafer Size : 2 ~8 inch Illumination Source : 25 mW laser, 405 nm wavelength Operator I Year(s) : 2009 Location : ASIA (North East)

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■ Capable up to 12" Wafer ■ SSM 52 Capacitance Measurement Unit ■ Motor control unit ■ Pneumatic control Unit Year(s) : 2008 Location : ASIA (North East)

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[ General Description ] Wafer Size : 2 ~ 6 inch Illumination Source : 25 mW laser, 405 nm wavelength Operator Year(s) : 2005 Location : ASIA (North East)

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[ General Description ] Wafer Size : 2 ~8 inch Illumination Source : 8mW laser, 635 nm wavelength Operator Int Year(s) : 2006 Location : ASIA (North East)

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■ Capable up to 12" Wafer ■ SSM 52 Capacitance Measurement Unit ■ Auto wafer handling (Genmark robot & pre ali Year(s) : 2004 Location : ASIA (North East)

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Used Semiconductor and PCB Manufacturing for sale

You will find machines for the manufacturing of the electronic chips and their assembly on printed circuit boards (PCB).

Semiconductors market have exceeded 500 billion usd in 2019. It covers memory devices, logic devices, analog IC, MPU, power devices, MCU, sensors, that will be used in an increasing number of applications such as computers, mobile phones, all electronic appliances, electronic in aotomotive industry, machinery and many more.

Once the semiconductors are manufactured they are assembled on the PCBs and main machines needed for this purpose are pick and place machines, sodering owen, secreen printing machines for solder paste, dispensers for glues.

This industry is largely located in Asia and expecially in China.

The main manufacturers machine are Mydata, Universal, Juki, Panasonic, Fuji, Samsung, Manncorp, Siemens, ASM, Quad, Assembleon, Universal Instruments, Europlacer, Philips, Advantest, AG Associates, Agilent, AMAT, Anritsu, Applied Materials, Aqueous Technologies, ASM, Asymtek, ASYSBausch & Lomb, Blue M, Branson, Branson / IPC, BTU, Camalot, Canon, CTI,Dage, DEK, Despatch, Disco, DNS, DynaPace, Ebara, Edwards, Ekra, Electro Design, Electroglas, Electrovert, Ersa, Esec, EVG, Gasonics, Heller, Hewlett Packard (HP), Hitachi, Jot, K & S, Kanetic, Karl Suss, Keithley, Keysight, KLA-Tencor, LAM, Leica, Leybold, Lynx, Mania, Matheson, Mirtec, MPM, Nanometrics, Nikon, NuTek, Olympus, Oxford, Plasmatherm, Rohde & Schwarz, Rudolph, Schmid, Seho, Semitool, Simplimatic, SMT, Speedline, Suss, Technics, Tegal, Tektronix, TEL, Tencor, Tenney, Teradyne, Thermotron, Tokyo Semitsu Kogaku (TSK), Varian, Veeco, Venntek, Verteq, Vitronics, Vitronics Soltec, VWR, West Bond, YESTech, Yield Engineering Systems (YES) 

The main model my12, TX2i SIPLACE, Mydata My200SX-14, KE-2050L, MY9, GSM2 4681A, Topax XII, CP40V, 730L, TX2i, SL940E, XP243E, 4982, MY15, MC389CY-F3-V, Siplace CA4, YG100-RB, MY100SXe-14

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