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Used Semiconductor and PCB Manufacturing

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1

Steag (AG Associates) Heatpulse 610 RTP Rapid Thermal Processing System. Manually loaded and capable of proce Location : AMERICA North (USA-Canada-Mexico)

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Accuthermo AW610 Rapid Thermal Processor. The AccuThermo AW610 is a rapid thermal processing (RTP) system, wh Location : AMERICA North (USA-Canada-Mexico)

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Clean Room Oven. Digital programmable controller. Overtemperature protection control. Used Hepa filter. Pu Location : AMERICA North (USA-Canada-Mexico)

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WEST BOND 747677E-79C Combination Bonder capable of Ball Bonding and Wedge Bonding. Bonder comes with two bond Location : AMERICA North (USA-Canada-Mexico)

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REL-4800 Manual 200mm Analytical Wafer Prober with Temperature Chuck. Precise, flexible and affordable RF/Micro Location : AMERICA North (USA-Canada-Mexico)

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150S Nomarski 1000X Microscope. Microscope has Nomarski optics on all objectives except for the 5X. Objectives Location : AMERICA North (USA-Canada-Mexico)

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4522 Manual Gold Ball Wire Bonder With heated work holder. For process development, production, research or ad Location : AMERICA North (USA-Canada-Mexico)

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4524 Manual Gold Ball Bonder. Versatile production capabilities for bonding applications from simple to discre Location : AMERICA North (USA-Canada-Mexico)

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PWM32-PS-R790 Photoresist Spinner. Location : AMERICA North (USA-Canada-Mexico)

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The Cary 6000i UV-Vis-NIR spectrophotometer has been tailored for unmatched photometric performance in the s Year(s) : 2018 Location : AMERICA North (USA-Canada-Mexico)

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Manual Analytical Wafer Probe Station. Wafer prober designed to support a broad range of precision probing ap Location : AMERICA North (USA-Canada-Mexico)

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View Pinnacle 250 Video Measuring Tool. The Pinnacle features a damped granite base and column, with passive Location : AMERICA North (USA-Canada-Mexico)

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HS-1202-EFG Friction-Aire® Class 1, Group D Hazardous Materials Oven. Ideally suited for the testing and proce Location : AMERICA North (USA-Canada-Mexico)

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7700E-79 Thermosonic Ball to Wedge Wire Bonder. Wedge Wire Bonder Bonds gold wires ranging from 0.0007” to 0.0 Location : AMERICA North (USA-Canada-Mexico)

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Branson Ultrasonics B950R Automatic Ultrasonic Vapor Degreaser. Branson B950R Ultrasonic Vapor Degreaser is th Location : AMERICA North (USA-Canada-Mexico)

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1300°C Seven Zone Tube Furnace. Model 7P1-60-230. Digital programmable controllers. Maximum temperature 1300°C Location : AMERICA North (USA-Canada-Mexico)

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310 Dual Function Image Reversal or HMDS Vapor Prime Oven. Capacity for HMDS Prime: 8 cassettes of 4” wafers, Location : AMERICA North (USA-Canada-Mexico)

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T16X16/OES Ultraviolet Ozone Cleaning System. Cleaning or oxidation with the UVOCS is accomplished by the comb Location : AMERICA North (USA-Canada-Mexico)

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Cryo-U8HL Cryo Pump. 9.5"OD, 8.375" ID ISO flange. Unit came off of a working system Location : AMERICA North (USA-Canada-Mexico)

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ST 260 Spin Rinser Dryer. High performance cleaning, rinsing and drying system for 25 wafer batch cassette. Cu Location : AMERICA North (USA-Canada-Mexico)

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3x 2200 W air-cooled Xenon Lamps 4000 cm2 exposure area High-irradiance testing up to 120 W/m2 (2 Sun) Touch s Location : AMERICA North (USA-Canada-Mexico)

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Senko APC 8000 Fiber Optic Polishing System. The APC-8000 features a superior fixture-to-platten locking mecha Location : AMERICA North (USA-Canada-Mexico)

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Ozone Surface Cleaner A photochemical interaction occurs in an atmosphere of ultraviolet radiation and ambient Location : AMERICA North (USA-Canada-Mexico)

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High Performance Tabletop Deep UV Mask Alignment and DUV Exposure System. Table top mask aligner. Adjustable v Location : AMERICA North (USA-Canada-Mexico)

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T10X10-OES Ultra Violet Ozone Cleaning System. UV/Ozone cleaning process provides a simple, inexpensive, fast Location : AMERICA North (USA-Canada-Mexico)

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Used Semiconductor and PCB Manufacturing for sale

You will find machines for the manufacturing of the electronic chips and their assembly on printed circuit boards (PCB).

Semiconductors market have exceeded 500 billion usd in 2019. It covers memory devices, logic devices, analog IC, MPU, power devices, MCU, sensors, that will be used in an increasing number of applications such as computers, mobile phones, all electronic appliances, electronic in aotomotive industry, machinery and many more.

Once the semiconductors are manufactured they are assembled on the PCBs and main machines needed for this purpose are pick and place machines, sodering owen, secreen printing machines for solder paste, dispensers for glues.

This industry is largely located in Asia and expecially in China.

The main manufacturers machine are Mydata, Universal, Juki, Panasonic, Fuji, Samsung, Manncorp, Siemens, ASM, Quad, Assembleon, Universal Instruments, Europlacer, Philips, Advantest, AG Associates, Agilent, AMAT, Anritsu, Applied Materials, Aqueous Technologies, ASM, Asymtek, ASYSBausch & Lomb, Blue M, Branson, Branson / IPC, BTU, Camalot, Canon, CTI,Dage, DEK, Despatch, Disco, DNS, DynaPace, Ebara, Edwards, Ekra, Electro Design, Electroglas, Electrovert, Ersa, Esec, EVG, Gasonics, Heller, Hewlett Packard (HP), Hitachi, Jot, K & S, Kanetic, Karl Suss, Keithley, Keysight, KLA-Tencor, LAM, Leica, Leybold, Lynx, Mania, Matheson, Mirtec, MPM, Nanometrics, Nikon, NuTek, Olympus, Oxford, Plasmatherm, Rohde & Schwarz, Rudolph, Schmid, Seho, Semitool, Simplimatic, SMT, Speedline, Suss, Technics, Tegal, Tektronix, TEL, Tencor, Tenney, Teradyne, Thermotron, Tokyo Semitsu Kogaku (TSK), Varian, Veeco, Venntek, Verteq, Vitronics, Vitronics Soltec, VWR, West Bond, YESTech, Yield Engineering Systems (YES) 

The main model my12, TX2i SIPLACE, Mydata My200SX-14, KE-2050L, MY9, GSM2 4681A, Topax XII, CP40V, 730L, TX2i, SL940E, XP243E, 4982, MY15, MC389CY-F3-V, Siplace CA4, YG100-RB, MY100SXe-14

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