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Used Semiconductor and PCB Manufacturing

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pick and place machine in excellent condition. Year(s) : 2004 Location : EUROPE (Western and Northern)

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Features: . 10.000 dots / hour . easy to use WindowsTM user interface . automatic optimization . possible CAD Year(s) : 2010 Location : EUROPE (Western and Northern)

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Features: Lead-free solder module Final solder nozzle Constant level foam fluxer Blow-off feature Pneumatic se Year(s) : 2004 Location : EUROPE (Western and Northern)

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Description: Pin chain transport: 5mm (7) Preheating zones (3) Peaks (3) Cooling zones Automatic adjustment of Year(s) : 2008 Location : EUROPE (Western and Northern)

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Features: Autoamtic optical inspection of PCB’s Inspects SMT & THT components (missing, type polarity Year(s) : 2007 Location : EUROPE (Western and Northern)

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Foot print 1600 x 1000 mm Height (without bench) 1400 mm Weight (without solder) approx. 255 kg Process wid Year(s) : 2006 Location : EUROPE (Western and Northern)

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Specificaties Model YSP Applicable PCB L 50 x W 50 mm (Min) to L 510 x W 460 mm (Max) *Applicable for transpor Year(s) : 2014 Location : EUROPE (Western and Northern)

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Embedded industrial PC With intelligent temperature module and stepper motor driver, Stable and reliable. Wind Location : EUROPE (Western and Northern)

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Embedded industrial PC With intelligent temperature module, Stable and reliable. Windows Operating system in E Year(s) : 2016 Location : EUROPE (Western and Northern)

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Dimensions (Width x Depth) 625 mm wide x 1250 mm deep (24.6 x 49.2 in.) Voltage 110-240 VAC, 50/60 Hz Amperage Year(s) : 2011 Location : EUROPE (Western and Northern)

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CD-SEM/6in. Location : ASIA (North East)

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Microscope Location : ASIA (North East)

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Specifications: Machine Alignment Capability >2 Cpk @ +/- 12.5µm, 6 Sigma # Process Alignment Capability >2 Cp Year(s) : 2010 Location : AMERICA North (USA-Canada-Mexico)

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Specifications: BOARD HANDLING Maximum Board Size (X x Y) 558 mm x 508 mm or (22” x 20”) Minimum Board Size Location : AMERICA North (USA-Canada-Mexico)

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3D Solder Paste Inspection 220V 1 Phase 50/60Hz Specifications ( See Details above for installed options ) Ko Year(s) : 2015 Location : AMERICA North (USA-Canada-Mexico)

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Vintage : SEP 2015 Left to Right Board Flow 18" Max Board Width Year(s) : 2015 Location : AMERICA North (USA-Canada-Mexico)

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14" Max Board Width Left to Right Board Flow 2 Sections Year(s) : 1998 Location : AMERICA North (USA-Canada-Mexico)

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100-240V Single Phase Year(s) : 2013 Location : AMERICA North (USA-Canada-Mexico)

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Refrigerant: 404A Internal Dims: 27"x45"x34" Location : AMERICA North (USA-Canada-Mexico)

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Refrigeration 1: 404A Refrigeration 2: 508B 115V Single Phase Year(s) : 2016 Location : AMERICA North (USA-Canada-Mexico)

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Model: CC-24I-1-SC-AB-0023 14" Max Board Width Left to Right Board Flow Year(s) : 2000 Location : AMERICA North (USA-Canada-Mexico)

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Description: BOARD HANDLING Maximum Board Size (X x Y) 558 mm x 508 mm or (22” x 20”) Minimum Board Size (Y x Year(s) : 2014 Location : AMERICA North (USA-Canada-Mexico)

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Refrigerant: R404A; 30 lbs Temp Range -20C to +177C 460V 3Phase 60hz 150Amp Year(s) : 2008 Location : AMERICA North (USA-Canada-Mexico)

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HR3690-2D 208/230V ; 3 Phase 2 Door Access/ Pull-Thru Location : AMERICA North (USA-Canada-Mexico)

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PCB Handling Equipment 14" Max Board Width Right to Left Board Flow Year(s) : 2005 Location : AMERICA North (USA-Canada-Mexico)

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Used Semiconductor and PCB Manufacturing for sale

You will find machines for the manufacturing of the electronic chips and their assembly on printed circuit boards (PCB).

Semiconductors market have exceeded 500 billion usd in 2019. It covers memory devices, logic devices, analog IC, MPU, power devices, MCU, sensors, that will be used in an increasing number of applications such as computers, mobile phones, all electronic appliances, electronic in aotomotive industry, machinery and many more.

Once the semiconductors are manufactured they are assembled on the PCBs and main machines needed for this purpose are pick and place machines, sodering owen, secreen printing machines for solder paste, dispensers for glues.

This industry is largely located in Asia and expecially in China.

The main manufacturers machine are Mydata, Universal, Juki, Panasonic, Fuji, Samsung, Manncorp, Siemens, ASM, Quad, Assembleon, Universal Instruments, Europlacer, Philips, Advantest, AG Associates, Agilent, AMAT, Anritsu, Applied Materials, Aqueous Technologies, ASM, Asymtek, ASYSBausch & Lomb, Blue M, Branson, Branson / IPC, BTU, Camalot, Canon, CTI,Dage, DEK, Despatch, Disco, DNS, DynaPace, Ebara, Edwards, Ekra, Electro Design, Electroglas, Electrovert, Ersa, Esec, EVG, Gasonics, Heller, Hewlett Packard (HP), Hitachi, Jot, K & S, Kanetic, Karl Suss, Keithley, Keysight, KLA-Tencor, LAM, Leica, Leybold, Lynx, Mania, Matheson, Mirtec, MPM, Nanometrics, Nikon, NuTek, Olympus, Oxford, Plasmatherm, Rohde & Schwarz, Rudolph, Schmid, Seho, Semitool, Simplimatic, SMT, Speedline, Suss, Technics, Tegal, Tektronix, TEL, Tencor, Tenney, Teradyne, Thermotron, Tokyo Semitsu Kogaku (TSK), Varian, Veeco, Venntek, Verteq, Vitronics, Vitronics Soltec, VWR, West Bond, YESTech, Yield Engineering Systems (YES) 

The main model my12, TX2i SIPLACE, Mydata My200SX-14, KE-2050L, MY9, GSM2 4681A, Topax XII, CP40V, 730L, TX2i, SL940E, XP243E, 4982, MY15, MC389CY-F3-V, Siplace CA4, YG100-RB, MY100SXe-14

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