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Used Semiconductor and PCB Manufacturing

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1

This West-Bond West-Bond 7372B Convertible Die Bonder can be converted between a 7200B Epoxy Die Bonder, and Location : EUROPE (Western and Northern)

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PECVD 80+ SiO2 Dep Non-functional tool but can be repaired (requires Silane MFC) Designed for 4” wafers but ca Location : EUROPE (Western and Northern)

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This West-bond 7400A Manual Ultrasonic/ Thermosonic 45° Feed Wedge-Wedge Wire Bonder looks to be in good cosm Location : EUROPE (Western and Northern)

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Three MaxumPlus Bonders upgraded by KNS from Maxum. Year(s) : 2004 Location : EUROPE (Western and Northern)

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Condition: very good Yushin Demounter 1 3Teile Glas Demount Tool for 6 and 8 inch Wafer. Glas Output Statio Year(s) : 2006 Location : EUROPE (Western and Northern)

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Mask & Wafer Inspection Working condition Year(s) : 2008 Location : EUROPE (Western and Northern)

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Eye Piece: SWH10 x /26.5 Objective lens: MpanFLN x5 x10 x20 Working Condition Year(s) : 2015 Location : EUROPE (Western and Northern)

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Latest Software 1x DLM-12 Nozzle Head with Nozzle Changer 2x Twin Head 3x HF-Feedertrolleys Year(s) : 2006 Location : EUROPE (Western and Northern)

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The LS-34TV Screen Printer by New Long is built with efficiency in mind. This high precision screen printer i Year(s) : 1999 Location : EUROPE (Western and Northern)

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Software Version: 505.05 Flexible High-Speed SMD placement system placement rate max. 40.400 components / h wi Location : EUROPE (Western and Northern)

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This 3D Systems InVision si2 3D Printer & InVision Finisher 1-A appears to be in fair cosmetic condition, alt Location : EUROPE (Western and Northern)

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Siemens HF3 With MTC2 Tray H12 x 2 + TH x 1 Software Version: 505.05 Fully reconditioned and refurbished Year(s) : 2005 Location : EUROPE (Western and Northern)

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This West-Bond 7200CR Dual Head Pick & Place Epoxy Die Bonder looks to be in good cosmetic condition, showing Location : EUROPE (Western and Northern)

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This West-Bond 7367B Eutectic Tweezer Bonder looks to be in good cosmetic condition, showing some signs of we Location : EUROPE (Western and Northern)

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This MEI Marpet Enterprises 1204B Manual Gold Ball Wire Bonder looks to be in good cosmetic condition, showi Location : EUROPE (Western and Northern)

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High Pressure Bonding Chamber Maximum 200 mm The equipment has been professionally de-installed Year(s) : 2012 Location : EUROPE (Western and Northern)

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Condition: Very Good Configuration: 12" Wafer sorter with: 2x Fixload V6 Multiple IOSS Wafer ID Reader 2x Bro Year(s) : 2001 Location : EUROPE (Western and Northern)

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Cassette to Cassette YES Condition Very Good CE Marked YES Year(s) : 2002 Location : EUROPE (Western and Northern)

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Condition: very good Developer with 2 chambers for spray developing. Wafer Size Range Minimum 150 mm Maxi Year(s) : 1996 Location : EUROPE (Western and Northern)

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Machine come with flip-chip configuration which you could review from the attached photos. Year(s) : 2023 Location : EUROPE (Western and Northern)

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Wafer Size 200mm Condition: Very Good Yushin Demounter 4 3 Teile Year of Manufacture 2011 Year(s) : 2011 Location : EUROPE (Western and Northern)

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TEL Lithius Coater Developer for Sale in Europe Its currently running wafers, complete and working condition Year(s) : 2005 Location : EUROPE (Western and Northern)

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Vintage 2008/9 These were working before de-installed and have been stored well as shown in the pictures since Year(s) : 2008 Location : EUROPE (Western and Northern)

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Specification: Universal Genesis GI14D 4988E + PTF - 2 axis with linear motors - 2 placement heads FlexJet Year(s) : 2005 Location : EUROPE (Western and Northern)

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WAFER SIZE 8,12 4 Chambers Year(s) : 2007 Location : EUROPE (Western and Northern)

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Used Semiconductor and PCB Manufacturing for sale

You will find machines for the manufacturing of the electronic chips and their assembly on printed circuit boards (PCB).

Semiconductors market have exceeded 500 billion usd in 2019. It covers memory devices, logic devices, analog IC, MPU, power devices, MCU, sensors, that will be used in an increasing number of applications such as computers, mobile phones, all electronic appliances, electronic in aotomotive industry, machinery and many more.

Once the semiconductors are manufactured they are assembled on the PCBs and main machines needed for this purpose are pick and place machines, sodering owen, secreen printing machines for solder paste, dispensers for glues.

This industry is largely located in Asia and expecially in China.

The main manufacturers machine are Mydata, Universal, Juki, Panasonic, Fuji, Samsung, Manncorp, Siemens, ASM, Quad, Assembleon, Universal Instruments, Europlacer, Philips, Advantest, AG Associates, Agilent, AMAT, Anritsu, Applied Materials, Aqueous Technologies, ASM, Asymtek, ASYSBausch & Lomb, Blue M, Branson, Branson / IPC, BTU, Camalot, Canon, CTI,Dage, DEK, Despatch, Disco, DNS, DynaPace, Ebara, Edwards, Ekra, Electro Design, Electroglas, Electrovert, Ersa, Esec, EVG, Gasonics, Heller, Hewlett Packard (HP), Hitachi, Jot, K & S, Kanetic, Karl Suss, Keithley, Keysight, KLA-Tencor, LAM, Leica, Leybold, Lynx, Mania, Matheson, Mirtec, MPM, Nanometrics, Nikon, NuTek, Olympus, Oxford, Plasmatherm, Rohde & Schwarz, Rudolph, Schmid, Seho, Semitool, Simplimatic, SMT, Speedline, Suss, Technics, Tegal, Tektronix, TEL, Tencor, Tenney, Teradyne, Thermotron, Tokyo Semitsu Kogaku (TSK), Varian, Veeco, Venntek, Verteq, Vitronics, Vitronics Soltec, VWR, West Bond, YESTech, Yield Engineering Systems (YES) 

The main model my12, TX2i SIPLACE, Mydata My200SX-14, KE-2050L, MY9, GSM2 4681A, Topax XII, CP40V, 730L, TX2i, SL940E, XP243E, 4982, MY15, MC389CY-F3-V, Siplace CA4, YG100-RB, MY100SXe-14

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