Used Semiconductor and PCB Manufacturing
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- Model: ABC200 - MHU - Main Handling Unit w/ Genmark GB8 Robot - Module 1: BA200 – Bond Aligner - Module 2: N Location : EUROPE (Western and Northern)
Price : On request
More detailsA MXP ETCH B MXP ETCH C MXP ETCH Good Condition Year(s) : 1997 Location : EUROPE (Western and Northern)
Price : On request
More detailsType: ICP HR Etch System Wafer Size: 8" Location : EUROPE (Western and Northern)
Price : On request
More detailsDual etch chamber system with handler Model 602E Year(s) : 2002 Location : EUROPE (Western and Northern)
Price : On request
More detailsWire Bonder Model Eagle 60 Year(s) : 2007 Location : EUROPE (Western and Northern)
Price : On request
More detailsIncludes Hesse DA 04 051 Deep Access Bondhead & Light Tower; Number of Bonds Approx 37,054,610; Dimensions o Year(s) : 2009 Location : EUROPE (Western and Northern)
Price : On request
More details7 sets ASM Harrier Bonders Vintage 2009~2010 Working condition Year(s) : 2009, 2010 Location : EUROPE (Western and Northern)
Price : On request
More detailsThis West-Bond 545657B is a Semi-Automatic Three-Way Convertible 45° Wire Feed Wedge, 90° Wire & Ribbon Feed Location : EUROPE (Western and Northern)
Price : On request
More detailsDie Bonder Model AD809M-06 Year(s) : 2002 Location : EUROPE (Western and Northern)
Price : On request
More detailsIncludes: FINEPLACER lambda Bonding force module FD3 Chip heating module Optional Dispensing Module FG3 WinFli Year(s) : 2017 Location : EUROPE (Western and Northern)
Price : On request
More detailsASM AD898 die bonder, 2 sets ASM AD898 for sale Ex works China , both vintage 2006, Can Trial Run. Year(s) : 2002 Location : EUROPE (Western and Northern)
Price : On request
More details Wafer Diameter Maximum 12" (300 mm) Wafer XY Table Travel (13” x 13”) 334 x 334mm Die Size (10 x 10 mil Year(s) : 2004 Location : EUROPE (Western and Northern)
Price : On request
More detailsStill inside crates Year(s) : 2011 Location : EUROPE (Western and Northern)
Price : On request
More detailsProcess: Die Attach Condition: Working Year(s) : 2010 Location : EUROPE (Western and Northern)
Price : On request
More detailsDie Bonder Model AD 838 Year(s) : 2013 Location : EUROPE (Western and Northern)
Price : On request
More detailsESEC 2100 FC HS Die Bonder De-installed. It should be complete, so they must go by the photos. Year(s) : 2017 Location : EUROPE (Western and Northern)
Price : On request
More details Wafer Diameter Maximum 12" (300 mm) Wafer XY Table Travel (13” x 13”) 334 x 334mm Die Size (10 x 10 mil Year(s) : 2003 Location : EUROPE (Western and Northern)
Price : On request
More detailsKLA-TENCOR Opti-2600 Thickness Measurement Year(s) : 1995 Location : EUROPE (Western and Northern)
Price : On request
More detailsKLA RS55/TCA Was complete and working condition before de-install Year(s) : 2005 Location : EUROPE (Western and Northern)
Price : On request
More detailsThis is being sold refurbished with a 3 months parts warranty. Its currently configured with SMIF but can be Year(s) : 1999 Location : EUROPE (Western and Northern)
Price : On request
More detailsForced air oven with inert gas purge max temp 316C/400F chamber 14x14x14 Digital temperature display overtem Year(s) : 2006 Location : EUROPE (Western and Northern)
Price : On request
More detailsAixtron Crius II MOCVD Vintage 2011 Removed from production in 2019 Year(s) : 2011 Location : EUROPE (Western and Northern)
Price : On request
More detailsScanning Electron Microscope Model S 4500 SEM Year(s) : 1994 Location : EUROPE (Western and Northern)
Price : On request
More detailsPin chain transport: 5mm (7) Preheating zones (3) Peaks (3) Cooling zones Automatic adjustment of the center s Year(s) : 2004 Location : EUROPE (Western and Northern)
Price : On request
More detailsKLA-Tencor UV 1280 SE Film Thickness Measurement Tool 6", 8" 2001 Vintage Year(s) : 2001 Location : EUROPE (Western and Northern)
Price : On request
More detailsUsed Semiconductor and PCB Manufacturing for sale
You will find machines for the manufacturing of the electronic chips and their assembly on printed circuit boards (PCB).
Semiconductors market have exceeded 500 billion usd in 2019. It covers memory devices, logic devices, analog IC, MPU, power devices, MCU, sensors, that will be used in an increasing number of applications such as computers, mobile phones, all electronic appliances, electronic in aotomotive industry, machinery and many more.
Once the semiconductors are manufactured they are assembled on the PCBs and main machines needed for this purpose are pick and place machines, sodering owen, secreen printing machines for solder paste, dispensers for glues.
This industry is largely located in Asia and expecially in China.
The main manufacturers machine are Mydata, Universal, Juki, Panasonic, Fuji, Samsung, Manncorp, Siemens, ASM, Quad, Assembleon, Universal Instruments, Europlacer, Philips, Advantest, AG Associates, Agilent, AMAT, Anritsu, Applied Materials, Aqueous Technologies, ASM, Asymtek, ASYSBausch & Lomb, Blue M, Branson, Branson / IPC, BTU, Camalot, Canon, CTI,Dage, DEK, Despatch, Disco, DNS, DynaPace, Ebara, Edwards, Ekra, Electro Design, Electroglas, Electrovert, Ersa, Esec, EVG, Gasonics, Heller, Hewlett Packard (HP), Hitachi, Jot, K & S, Kanetic, Karl Suss, Keithley, Keysight, KLA-Tencor, LAM, Leica, Leybold, Lynx, Mania, Matheson, Mirtec, MPM, Nanometrics, Nikon, NuTek, Olympus, Oxford, Plasmatherm, Rohde & Schwarz, Rudolph, Schmid, Seho, Semitool, Simplimatic, SMT, Speedline, Suss, Technics, Tegal, Tektronix, TEL, Tencor, Tenney, Teradyne, Thermotron, Tokyo Semitsu Kogaku (TSK), Varian, Veeco, Venntek, Verteq, Vitronics, Vitronics Soltec, VWR, West Bond, YESTech, Yield Engineering Systems (YES)
The main model my12, TX2i SIPLACE, Mydata My200SX-14, KE-2050L, MY9, GSM2 4681A, Topax XII, CP40V, 730L, TX2i, SL940E, XP243E, 4982, MY15, MC389CY-F3-V, Siplace CA4, YG100-RB, MY100SXe-14