Used Semiconductor and PCB Manufacturing
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FEATURES - HYBOND Soft TouchTM energy system. - Front panel ultrasonic test button. - Deep vertical access of Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details552 is a wedge bonder with thermocompression Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details572 is a Vertical Feed Ultrasonic Wedge/ Wire Bonder Location : AMERICA North (USA-Canada-Mexico)
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More details50WS welder has a 50 WATT second capacitive discharge. Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailswelder has a heavy duty weld head Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsHTT-550 welder has a solder reflow system. Includes VTA66 head and TEM calibrator. Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsCu Film thickness measurement Version: 300 mm Location : AMERICA North (USA-Canada-Mexico)
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More detailsPVD cluster tool Version: 150 mm De-installed by the OEM . In working condition. Warehoused. Can be inspected Location : AMERICA North (USA-Canada-Mexico)
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More detailsDouble sided CO2 Laser marking system Brand HGTech Dual Headed system. Mark both sides in a single pass. High Year(s) : 2021 Location : EUROPE (Western and Northern)
Price : On request
More detailsNov-2012 Upgraded to MY200 Vintage 2012 SW Version 5.2.1e Year(s) : 2012 Location : EUROPE (Western and Northern)
Price : On request
More detailsSelective Soldering Machine Year(s) : 2009 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsLead Tinning Machine Features: Tin-Lead Solder Year(s) : 2015 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsTabletop PCB inspection system. Machine has less than 50 working hours. Contact us for further information. Year(s) : 2019 Location : EUROPE (Central and Eastern)
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More detailsAvailable is one complete SMT line with following machines: CTI Systems DS-.6M-BBL-LT-UL bare board loader CT Year(s) : 2018 Location : EUROPE (Central and Eastern)
Price : On request
More detailsFirst machine Year of manufacture: 2010 PCB transport: dual-lane conveyor Station s/w ver.: 708.2SP3 Visio Year(s) : 2010 Location : EUROPE (Central and Eastern)
Price : On request
More detailsPlastic Wet Bench Location : AMERICA North (USA-Canada-Mexico)
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More detailsFIFO Buffer Model NTM640SL Location : AMERICA North (USA-Canada-Mexico)
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More detailsFIFO Buffer 5 Position Location : AMERICA North (USA-Canada-Mexico)
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More detailsGlow Discharge Atomic Emission Spectrometer Metal Test GD-OES. GD-OES (Glow Discharge – Optical Emission Spec Year(s) : 1997 Location : EUROPE (Western and Northern)
Price : On request
More details- Hine indexer - 1 chamber Automation online component: SECS/GEM - No fixed gap chamber - EPD: Verity EP200Mmd Location : ASIA (North East)
Price : On request
More detailsCylinder cabinet (NH3,NH3) Year(s) : 1993 Location : ASIA (North East)
Price : On request
More detailsTaping machine Year(s) : 1994 Location : ASIA (North East)
Price : On request
More detailsTape peeling machine Year(s) : 1998 Location : ASIA (North East)
Price : On request
More detailsDry etching system (SiO2) Year(s) : 2011 Location : ASIA (North East)
Price : On request
More detailsDiffusion furnace (OX) Year(s) : 2000 Location : ASIA (North East)
Price : On request
More detailsUsed Semiconductor and PCB Manufacturing for sale
You will find machines for the manufacturing of the electronic chips and their assembly on printed circuit boards (PCB).
Semiconductors market have exceeded 500 billion usd in 2019. It covers memory devices, logic devices, analog IC, MPU, power devices, MCU, sensors, that will be used in an increasing number of applications such as computers, mobile phones, all electronic appliances, electronic in aotomotive industry, machinery and many more.
Once the semiconductors are manufactured they are assembled on the PCBs and main machines needed for this purpose are pick and place machines, sodering owen, secreen printing machines for solder paste, dispensers for glues.
This industry is largely located in Asia and expecially in China.
The main manufacturers machine are Mydata, Universal, Juki, Panasonic, Fuji, Samsung, Manncorp, Siemens, ASM, Quad, Assembleon, Universal Instruments, Europlacer, Philips, Advantest, AG Associates, Agilent, AMAT, Anritsu, Applied Materials, Aqueous Technologies, ASM, Asymtek, ASYSBausch & Lomb, Blue M, Branson, Branson / IPC, BTU, Camalot, Canon, CTI,Dage, DEK, Despatch, Disco, DNS, DynaPace, Ebara, Edwards, Ekra, Electro Design, Electroglas, Electrovert, Ersa, Esec, EVG, Gasonics, Heller, Hewlett Packard (HP), Hitachi, Jot, K & S, Kanetic, Karl Suss, Keithley, Keysight, KLA-Tencor, LAM, Leica, Leybold, Lynx, Mania, Matheson, Mirtec, MPM, Nanometrics, Nikon, NuTek, Olympus, Oxford, Plasmatherm, Rohde & Schwarz, Rudolph, Schmid, Seho, Semitool, Simplimatic, SMT, Speedline, Suss, Technics, Tegal, Tektronix, TEL, Tencor, Tenney, Teradyne, Thermotron, Tokyo Semitsu Kogaku (TSK), Varian, Veeco, Venntek, Verteq, Vitronics, Vitronics Soltec, VWR, West Bond, YESTech, Yield Engineering Systems (YES)
The main model my12, TX2i SIPLACE, Mydata My200SX-14, KE-2050L, MY9, GSM2 4681A, Topax XII, CP40V, 730L, TX2i, SL940E, XP243E, 4982, MY15, MC389CY-F3-V, Siplace CA4, YG100-RB, MY100SXe-14