Used Grinding, Lapping & Polishing
67 resultsRexon belt and disc sander 230 V ~ / 50 Hz / 450 W L (length) 0.54m / W (width) 0.34m H (height) 0.30 m / G ( Location : EUROPE (Western and Northern)
Price : On request
More detailsPower Requirements 240 V 2.0 A 50/60 Hz 1 Phase Exterior Dimensions Width 14.000 in (35.6 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsHigh density, cast iron radially serrated lap plate 12” O.D. x 3” Includes: Masterflex L/S Economy Variable-Sp Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsFully-Auto LED Wafer Prober Year(s) : 2011 Location : ASIA (North East)
Price : On request
More detailsSW-08 Year(s) : 2010 Location : ASIA (North East)
Price : On request
More detailsWafer Polishing Machine Year(s) : 2011 Location : ASIA (North East)
Price : On request
More detailsGAN Grind Machine Year(s) : 2012 Location : ASIA (North East)
Price : On request
More detailsDFG-83H/6 Description Back side grinder Year(s) : 1994 Location : ASIA (North East)
Price : On request
More details24B Description Polisher Year(s) : 2000 Location : ASIA (North East)
Price : On request
More detailsTISI ID 150901-48 Manufacturer Semitool Model Spectral Description Poly Strip Wafer Size 200mm Vintage 7 Location : ASIA (North East)
Price : On request
More detailsTISI ID 150917-200 Manufacturer DISCO Model DFG8140 Description Back side polisher DFG8140 Wafer Size 8" Location : ASIA (North East)
Price : On request
More detailsTISI ID 151013-223 Manufacturer SPEEDFAM Model 32 DPAW Description Wafer Polishing Machine Location : ASIA (North East)
Price : On request
More details- Was Fully Operational in the USA before removal - Comes with a supply of some Spare Parts - Includes a hard- Year(s) : 2004 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details15 WITH 3 RINGS, AND SLURRY PUMP Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsSpecifications: Resolution: 1µm Full range accuracy (at 20°C): 3µm over 25mm Max allowable preset value: Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsSpecifications: Workpiece material: Glass Max substrate: 300mm X Axis Specifications: Stroke: 300mm S Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsGeneral Specifications: Table diameter: 300mm Max. workpiece size: 400mm dia x 200mm H Table revolution speed: Year(s) : 2000 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsFully Automatic Wafer Back Grinder Version: 200 MM Year(s) : 2004 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsFully Automatic Wafer Back Grinder Version: 200 MM Vintage: 01.06.2004 The equipment has been professionally d Year(s) : 2004 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsFully Automatic Grinding-Polishing System. Fully automated means that samples can be prepared from start to Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsWafer Size: 300mm Year(s) : 2001, 2004 Location : EUROPE (Western and Northern)
Price : On request
More detailsAR Coating system Year(s) : 2008 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsFully automated, single wafer IPEC polisher designed to accommodate 100 to 200mm diameter wafers. Polisher fea Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsmaximum substrate 3" diameter includes vacuum tube and chuck Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details300mm polishing platten with glass surface integral vacuum manifold single motorized workstation abrasive auto Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsYou can find used Grinding, Lapping & Polishing on Wotol
The main manufacturers of Grinding, Lapping & Polishing are Disco, Strasbaugh, Speedfam, Logitech, Lapmaster, Semitool, Buehler, Ebara, Okamoto, Peter Wolters, AMAT, Harig, Premier Mill, Struers, ABB, Advanced Imaging, Branson / IPC, DNS, DS Precision, Fujikoshi, GMN, Leco, NEWLONG, Nitto, Polyflow, Schmoll, Seiko Instruments, Telmec , Ultron
The main model Polyflow S412, HR8500-II, 6EC, 7AA,EPD 300X, Harig EZ SURF, SSG 800 HT, 6DF-SP, 15, UH114, SL13.6, MPS 400, MK II-8, S-LM-116G, OFL-11, Q150GB , 24B, PP5, 1010, Mirra OnTrak, ST260D, DFP8140, S16B, GNX-300, DFG840HS, Rotopol 21,12, MiniMet, Mill NETZSCH, SG-1000HR, 10” web coating.
HS Code 8486 10 50 for Grinding, polishing and lapping machines for processing of semiconductor wafers