Pesl

Ref : 1806130-9-CP

Condition : Used

Manufacturer : Pesl

Model : -

Short Description : -

Year(s) : -

Quantity : 0

Location : Seller or machines location:
EUROPE (Western and Northern)

Last check : 18 Apr. 2018

PESL Heated stage flip chip bonder DB5/TC designed for the assembly of all types and sizes of semi-conductor dice . Vertical tool action with CCTV Veertical illumination via split field optics Dual camera system Manual overide facility Heated substrate Electronic positioning via a mouse. 282

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