EVG 501 Wafer Bonder

Capable of thermo compression,
fusion or anodic wafer bonding
Bond chamber for small pieces up to 150mm wafers
(with correct tooling)
Thickness: Max wafer stack thickness 6mm
Bottom side heater: 550°C max. in 1°C steps
Temperature uniformity: ± 1,5 %
Turbo Pump
High voltage power supply for anodic bonding
(additional tooling may be required)
Electronics Rack
Computer & Software
LCD Monitor
Roughing Pump
Operations Manual for EVG 501 Bonder
Available for full inspection and demonstration
Installation, training, service, and
support available worldwide for
all our refurbished EVG Bonders