ESEC2100FC HS Flip Chip Bonder
Ref :
2772885-9
Condition :
Used
Manufacturer :
-
Model :
ESEC2100FC HS
Short Description :
Flip Chip Bonder
Year(s) :
2022
Quantity :
1
Location :
Seller or machines location:
ASIA (North East)
ASIA (North East)
Last check :
04 Feb. 2026
Flip Chip Bonder
Maker BESI
Other machines similar to ESEC2100FC HS Flip Chip Bonder
1
Viking 1060 Bonder
Location :
AMERICA North (USA-Canada-Mexico)
1
West Bond 7400A-32
Location :
AMERICA North (USA-Canada-Mexico)
1
Hughes 2460-III Bonder
Location :
AMERICA North (USA-Canada-Mexico)
1
Hybond 522-10-21-24 Bonder
Location :
AMERICA North (USA-Canada-Mexico)